公开(公告)号：US06678581B2

公开(公告)日：2004-01-13

申请号：US10047331

申请日：2002-01-14

申请人： Kwun-Goo Hung ,  Tung-Li Lee ,  Ko-Chin Chung ,  Fan-Lin Lu

发明人： Kwun-Goo Hung ,  Tung-Li Lee ,  Ko-Chin Chung ,  Fan-Lin Lu

IPC分类号： G06F1900

CPC分类号： H01L21/68707

摘要： A method of calibrating a wafer edge gripping end effector. A wafer calibration tool is held in a stationary position simulating the position of a semiconductor wafer to be picked up by the wafer edge gripping end effector. A controller associated with a robot having an end effector attached to a robot arm thereto is turned off. The robot arm and end effector are moved to position where the first and second clamp structures on the end effector each engage a respective inner edge that in part defines a notch formed in the wafer calibration tool. An actuator driven movable clamp structure is manually advanced so that the movable clamp structure engages an inner edge that in part defines one of the notches formed in the wafer calibration tool. The controller is turned on and data regarding the location of robot arm, end effector and movable clamp structure is stored.

摘要翻译： 一种校准晶片边缘夹持端部执行器的方法。 晶片校准工具被保持在模拟由晶片边缘夹持端部执行器拾取的半导体晶片的位置的静止位置。 关闭与机器人相关联的控制器，其具有附接到机器人手臂的末端执行器。 机器人臂和末端执行器被移动到位于末端执行器上的第一和第二夹紧结构各自接合相应的内边缘的位置，该内边缘部分地限定在晶片校准工具中形成的切口。 致动器驱动的可动夹紧结构被手动推进，使得可移动夹具结构接合内边缘，该内边缘部分地限定在晶片校准工具中形成的凹口中的一个。 打开控制器，并存储关于机器人臂，末端执行器和可移动夹具结构的位置的数据。