Hybird cooling system for electronic components
    1.
    发明授权
    Hybird cooling system for electronic components 失效
    Hybird冷却系统用于电子元器件

    公开(公告)号:US5285347A

    公开(公告)日:1994-02-08

    申请号:US830952

    申请日:1992-02-06

    IPC分类号: H05K7/20

    摘要: An improved method for removing heat from electronic devices, such as computer modules, is described. A flow of gas, such as air, cools the components. The gas flow is sufficient to cool so called "hot" components to their maximum operating temperature, and to cool the other components to their normal operating range. A liquid cooling system is also provided to cool the "hot" components to their normal operating range.

    摘要翻译: 描述了一种用于从诸如计算机模块的电子设备移除热量的改进方法。 诸如空气的气体流使部件冷却。 气流足以将所谓的“热”组分冷却至其最大工作温度,并将其它组分冷却至正常工作范围。 还提供液体冷却系统以将“热”组件冷却至其正常工作范围。