公开(公告)号：US08778706B2

公开(公告)日：2014-07-15

申请号：US12940533

申请日：2010-11-05

申请人： Philip Yi Zhi Chu ,  Stanley Tafeng Kao ,  Lev Katsenelenson

发明人： Philip Yi Zhi Chu ,  Stanley Tafeng Kao ,  Lev Katsenelenson

IPC分类号： H01L33/56

CPC分类号： G02B5/0221 ,  B29C33/68 ,  B29K2083/00 ,  G02B5/0278 ,  G02B27/0955 ,  H01L2933/005 ,  H01L2933/0091

摘要： Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

摘要翻译： 封装的LED可以通过采用限定了透镜形状的空腔的模具来提供，并且提供限定膜的表面中的微结构的倒数的图案化剥离膜。 图案化的脱模膜符合模具的空腔。 将LED芯片放置成与空腔中的图案化隔离膜隔开的关系。 然后将树脂引入到LED芯片和空腔中的图案化脱模膜之间的空间中。 在图案化的脱模膜和固化树脂之间保持接触的同时，在LED芯片和图案化的脱模膜之间的空间中树脂被固化。 然后封装的LED从模具工具和图案化的脱模膜中脱离出来。

公开(公告)号：US20110108874A1

公开(公告)日：2011-05-12

申请号：US12940533

申请日：2010-11-05

申请人： Philip Yi Zhi Chu ,  Stanley Tafeng Kao ,  Lev Katsenelenson

发明人： Philip Yi Zhi Chu ,  Stanley Tafeng Kao ,  Lev Katsenelenson

IPC分类号： H01L33/56 ,  H01L33/58

CPC分类号： G02B5/0221 ,  B29C33/68 ,  B29K2083/00 ,  G02B5/0278 ,  G02B27/0955 ,  H01L2933/005 ,  H01L2933/0091

摘要： Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

摘要翻译： 封装的LED可以通过采用限定了透镜形状的空腔的模具来提供，并且提供限定膜的表面中的微结构的倒数的图案化剥离膜。 图案化的脱模膜符合模具的空腔。 将LED芯片放置成与空腔中的图案化隔离膜隔开的关系。 然后将树脂引入到LED芯片和空腔中的图案化脱模膜之间的空间中。 在图案化的脱模膜和固化树脂之间保持接触的同时，在LED芯片和图案化的脱模膜之间的空间中树脂被固化。 然后封装的LED从模具工具和图案化的脱模膜中脱离出来。