公开(公告)号：US20240355970A1

公开(公告)日：2024-10-24

申请号：US18520802

申请日：2023-11-28

申请人： Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., LTD.

发明人： Xiaobo ZHOU

IPC分类号： H01L33/54 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L33/56 ,  H01L2933/005

摘要： A display panel and a manufacturing method thereof, and a splicing display screen are provided. The display panel includes a substrate, light-emitting components, a frame, and an encapsulant. The light-emitting components are disposed on the substrate. The frame is disposed on the substrate and located at a periphery around the light-emitting components. The encapsulant is disposed to cover outer surfaces of the light-emitting components. The frame includes a first barrier wall and a second barrier wall sequentially stacked in a direction from the substrate to the light-emitting components, and a transmittance of the second barrier wall is greater than a transmittance of the first barrier wall.

公开(公告)号：US12125953B2

公开(公告)日：2024-10-22

申请号：US17456556

申请日：2021-11-24

申请人： NICHIA CORPORATION

发明人： Shimpei Sasaoka ,  Toshiyuki Hashimoto ,  Toshinobu Katsumata ,  Naoya Kashiwagi

IPC分类号： H01L33/54 ,  H01L33/00 ,  H01L33/48 ,  H01L33/56

CPC分类号： H01L33/54 ,  H01L33/005 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/005

摘要： A method for manufacturing a light emitting device according to the present invention includes: providing an intermediate member including: a support member including: housing portions, the housing portions having first recessed portion(s) each having a lateral wall and a bottom surface, and a coupling portion located between adjacent ones of the housing portions and having a height lower than a height of the lateral wall with reference to the bottom surface of the first recessed portion, a light source mounted on the bottom surface of the first recessed portion, and an encapsulant disposed in the first recessed portion; and forming a first light-transmissive member continuously covering the housing portions and the coupling portion. An inclined surface of the first light-transmissive member has a height above the coupling portion is lower than a height above the housing portions with reference to the bottom surface of the first recessed portion.

公开(公告)号：US20240343969A1

公开(公告)日：2024-10-17

申请号：US18293552

申请日：2022-07-29

申请人： PARIS SCIENCES ET LETTRES ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  ECOLE NATIONALE SUPERIEURE DE CHIMIE DE PARIS

发明人： Moheddine WEHBIE ,  Vincent SEMETEY ,  Michel MINIER

IPC分类号： C09K11/01 ,  C09K11/77 ,  C22B3/44 ,  C22B7/00 ,  C22B11/00 ,  C22B15/00 ,  H01L33/00

CPC分类号： C09K11/01 ,  C09K11/7701 ,  C09K11/7706 ,  C09K11/7774 ,  C22B3/44 ,  C22B7/007 ,  C22B11/046 ,  C22B15/0073 ,  C22B15/0089 ,  H01L33/005 ,  H01L2933/005

摘要： A method for extracting and separating at least one component from a LED, the LED including at least one metal, at least one phosphor and at least one layer including polydimethylsiloxane. Also, an LED having at least one layer including polydimethylsiloxane, wherein the at least one layer comprising polydimethylsiloxane is depolymerized by the action of a solution including a solvent and a fluorine salt.

公开(公告)号：US12119433B2

公开(公告)日：2024-10-15

申请号：US17544129

申请日：2021-12-07

申请人： Nichia Corporation

发明人： Kazuyo Iwamoto ,  Masaya Miyazaki

IPC分类号： H01L33/56 ,  H01L33/00 ,  H01L33/10 ,  H01L33/38

CPC分类号： H01L33/56 ,  H01L33/005 ,  H01L33/10 ,  H01L33/382 ,  H01L2933/0016 ,  H01L2933/005

摘要： A method of manufacturing a light emitting device includes: providing a light emitting element comprising: a semiconductor laminate having a first surface, a second surface, and a lateral surface between the first and second surfaces, and an electrode disposed at the second surface; disposing a resin layer in an A-stage state on a support; placing the light emitting element on an upper surface of the resin layer while the upper surface of the resin layer and the first surface of the semiconductor laminate face each other; heating the resin layer at a first temperature to reduce a viscosity of the resin layer and causing the light emitting element to sink due to its own weight such that the second surface of the semiconductor laminate is exposed; and curing the resin layer by heating the resin layer at a second temperature higher than the first temperature, thereby forming a resin member.

公开(公告)号：US20240339582A1

公开(公告)日：2024-10-10

申请号：US18743884

申请日：2024-06-14

申请人： Micron Technology, Inc.

发明人： Kevin Tetz ,  Charles M. Watkins

IPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52

CPC分类号： H01L33/64 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/52 ,  H01L33/644 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075

摘要： Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US20240339579A1

公开(公告)日：2024-10-10

申请号：US18472234

申请日：2023-09-22

申请人： INGENTEC CORPORATION

发明人： Ai-Sen LIU ,  Hsiao-Lu CHEN ,  Yi-Chuan HUANG ,  Hsiang-An FENG

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/54

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L2933/005 ,  H01L2933/0066

摘要： A manufacturing method of a light-emitting diode package structure includes the steps as follows. A substrate is provided. At least one light-emitting diode and at least one dummy plug are arranged on the substrate in an arranging step. The light-emitting diode and the dummy plug are covered by the patternable material in a coating step. A portion of the light-emitting diode and a portion of the dummy plug are exposed in a patterning step. A conductive layer is in contact with and electrically connected to the light-emitting diode and the dummy plug in a deposition step. A protective layer is formed on the conductive layer in a protective layer forming step. The substrate is separated and a light-emitting diode package structure is formed in a releasing step. A material of the conductive layer includes an indium tin oxide material or a transparent conductive material.

公开(公告)号：US20240322073A1

公开(公告)日：2024-09-26

申请号：US18736157

申请日：2024-06-06

申请人： Applied Materials, Inc.

发明人： Thomas Joseph Knisley ,  Bhaskar Jyoti Bhuyan ,  Mark Saly ,  Mingwei Zhu

IPC分类号： H01L33/00

CPC分类号： H01L33/0095 ,  H01L33/0093 ,  H01L2933/005

摘要： Method for cleaning and encapsulating microLED features are disclosed. Some embodiments provide for a wet clean process and a dry clean process to remove contaminants from the microLED feature. Some embodiments provide for the encapsulation of a clean microLED feature. Some embodiments provide improved crystallinity of the microLED feature and the capping layer. Some embodiments provide improved EQE of microLED devices formed from the disclosed microLED features.

公开(公告)号：US20240274761A1

公开(公告)日：2024-08-15

申请号：US18336033

申请日：2023-06-16

申请人： AUO Corporation

发明人： Yi-Yueh Hsu ,  Kuan-Hsun Chen

IPC分类号： H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/005

摘要： A display apparatus includes a display panel. The display panel includes a driving backplane, multiple light-emitting elements, an encapsulation layer, and a fixing glue. The light emitting elements are disposed on the driving backplane and electrically connected to the driving backplane. The encapsulation layer is disposed on the driving backplane and covers the light emitting elements. The encapsulation layer includes a protruding portion extending beyond the driving backplane. The fixing glue is disposed between the protruding portion of the encapsulation layer and a side wall of the driving backplane. In addition, a manufacturing method of the display panel is also proposed.

公开(公告)号：US20240274760A1

公开(公告)日：2024-08-15

申请号：US18330382

申请日：2023-06-07

申请人： AUO Corporation

发明人： Yi-Yueh Hsu ,  Kuan-Hsun Chen ,  Yi-Sheng Jhao

IPC分类号： H01L33/54 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L25/0753 ,  H01L2933/005

摘要： A display apparatus includes a driving backplane, a plurality of light emitting devices, a first encapsulation pattern, and a second encapsulation pattern. The light emitting devices are disposed on the driving backplane and electrically connected to the driving backplane. The first encapsulation pattern includes a first portion and a second portion. The first portion is disposed on the driving backplane. The second portion is disposed on the first portion of the first encapsulation pattern, covers a plurality of sidewalls of the light emitting devices, and has a plurality of first openings overlapping a plurality of top surfaces of the light emitting devices. The second encapsulation pattern is disposed on the first portion of the first encapsulation pattern and has a plurality of second openings. The second openings are overlapped with the top surfaces of the light emitting devices and the second portion of the first encapsulation pattern.

公开(公告)号：US12062742B2

公开(公告)日：2024-08-13

申请号：US17653659

申请日：2022-03-07

申请人： Unimicron Technology Corp.

发明人： Hao-Wei Tseng ,  Chi-Hai Kuo ,  Jeng-Ting Li ,  Ying-Chu Chen ,  Pu-Ju Lin ,  Cheng-Ta Ko

IPC分类号： H01L33/54 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/54 ,  H01L24/83 ,  H01L25/0753 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29194 ,  H01L2224/32227 ,  H01L2224/83099 ,  H01L2224/83203 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8389 ,  H01L2924/12041 ,  H01L2933/005

摘要： A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.