Integrated heat dissipating enclosure for electronic product
    2.
    发明申请
    Integrated heat dissipating enclosure for electronic product 失效
    电子产品集成散热外壳

    公开(公告)号:US20050126806A1

    公开(公告)日:2005-06-16

    申请号:US10437008

    申请日:2003-05-14

    CPC classification number: G06F1/181 G06F1/20 H05K7/20418

    Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.

    Abstract translation: 集成的散热外壳,用于为计算机,电源或其它电子产品(如主板上的集成电路,中央处理单元或视频适配器上的芯片)提供散热。 外壳有一个框架和一个冷却盖。 该帧用于携带计算机的各种内部组件或外围设备。 冷却盖具有通过空间彼此隔开的多个翅片。 翅片通过导热管连接在一起以形成集成的散热外壳。

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