公开(公告)号：US20110277977A1

公开(公告)日：2011-11-17

申请号：US12917432

申请日：2010-11-01

Applicant: Kuo-Sheng Lin ,  Lin-Min Sun ,  Ching-Hsiang Cheng

Inventor： Kuo-Sheng Lin ,  Lin-Min Sun ,  Ching-Hsiang Cheng

IPC: F28F1/10 ,  B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/006 ,  F28F1/32 ,  Y10T29/49378

Abstract: The present invention provides a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a heat sink and a heat pipe. The heat sink has an end surface provided with a groove. The heat pipe is received in the groove. The heat pipe has a heat-absorbing surface and a heat-conducting surface. The heat-conducting surface is adhered to the inner edge of the groove. The heat-absorbing surface is in flush with the end surface. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.

Abstract translation: 本发明提供一种散热装置及其制造方法。 散热装置包括散热器和热管。 散热器具有设置有凹槽的端面。 热管被容纳在凹槽中。 热管具有吸热表面和导热表面。 导热表面粘附到凹槽的内边缘。 吸热表面与端面齐平。 通过这种布置，散热装置的耐热性降低，从而提高散热装置的散热效果。