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    Cooling device with easy-to-weld structure
    2.
    发明授权
    Cooling device with easy-to-weld structure 有权

    公开(公告)号：US12044481B2

    公开(公告)日：2024-07-23

    申请号：US18498714

    申请日：2023-10-31

    申请人： SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.

    发明人： Alex Horng ,  Ming-Tsung Li ,  Chi-Ting Yeh

    IPC分类号： F28D15/04 ,  B23P15/26

    CPC分类号： F28D15/04 ,  B23P15/26 ,  B23P2700/09

    摘要： A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.

    Cooling device with easy-to-weld structure
    3.
    发明授权
    Cooling device with easy-to-weld structure 有权

    公开(公告)号：US11846470B2

    公开(公告)日：2023-12-19

    申请号：US17407639

    申请日：2021-08-20

    申请人： SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.

    发明人： Alex Horng ,  Ming-Tsung Li ,  Chi-Ting Yeh

    IPC分类号： F28D15/04 ,  B23P15/26

    CPC分类号： F28D15/04 ,  B23P15/26 ,  B23P2700/09

    摘要： A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.

    Heat dissipation unit manufacturing method
    7.
    发明授权
    Heat dissipation unit manufacturing method 有权

    公开(公告)号：US09895778B2

    公开(公告)日：2018-02-20

    申请号：US14952923

    申请日：2015-11-26

    申请人： ASIA VITAL COMPONENTS CO., LTD.

    发明人： Sheng-Huang Lin

    IPC分类号： B23P15/26

    CPC分类号： B23P15/26 ,  B23P2700/09 ,  F28D15/0275 ,  F28F2275/12

    摘要： A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit manufacturing method improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

    HEAT DISSIPATION DEVICE MANUFACTURING METHOD
    10.
    发明申请
    HEAT DISSIPATION DEVICE MANUFACTURING METHOD 审中-公开

    公开(公告)号：US20170080533A1

    公开(公告)日：2017-03-23

    申请号：US14857784

    申请日：2015-09-17

    申请人： ASIA VITAL COMPONENTS CO., LTD.

    发明人： Sheng-Huang Lin ,  Yuan-Yi Lin

    IPC分类号： B23P15/26

    CPC分类号： B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/0275 ,  H01L21/4871 ,  H01L23/427

    摘要： A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.