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    Megasonic precision cleaning of semiconductor process equipment components and parts
    1.
    发明授权
    Megasonic precision cleaning of semiconductor process equipment components and parts 有权
    超声波精密清洗半导体工艺设备零部件

    公开(公告)号：US08607806B2

    公开(公告)日：2013-12-17

    申请号：US13665898

    申请日：2012-10-31

    申请人： Yaobo Yin ,  Linda (Tong) Jiang

    发明人： Yaobo Yin ,  Linda (Tong) Jiang

    IPC分类号： B08B3/12

    CPC分类号： H01L21/67051 ,  B08B3/12 ,  B08B2203/0288 ,  H01L21/67057 ,  H01L21/67086

    摘要： Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A fluid supply assembly supplies a fluid to a surface of the processing component and a beam assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustic energy to the fluid during cleaning.

    摘要翻译： 提供了用于使用包括兆声波箱，扫描兆声板，兆声波射流和兆声波扫描光束等的兆声波能量与选择性化学物质组合清洁处理部件的装置，以从处理部件的表面去除亚微米颗粒污染物， 用于清洁半导体，医疗或任何其他处理基板。 该装置包括具有被配置为支撑处理部件的载体元件的处理室。 载体元件包括在清洁期间翻转处理室内的处理部件的机构。 流体供应组件将流体供应到处理部件的表面，并且配备有兆声换能器的束组件用于在清洁期间向流体提供高频兆声声能。

    Method and apparatus for cleaning low K dielectric and metal wafer surfaces
    2.
    发明授权
    Method and apparatus for cleaning low K dielectric and metal wafer surfaces 有权
    用于清洁低K电介质和金属晶片表面的方法和设备

    公开(公告)号：US06319330B1

    公开(公告)日：2001-11-20

    申请号：US09618198

    申请日：2000-07-18

    申请人： Linda (Tong) Jiang ,  Diane J. Hymes

    发明人： Linda (Tong) Jiang ,  Diane J. Hymes

    IPC分类号： B08B704

    CPC分类号： H01L21/0206 ,  B08B1/04 ,  B08B3/08 ,  H01L21/02063 ,  H01L21/02074 ,  H01L21/67046 ,  Y10S134/902

    摘要： Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (b) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.

    摘要翻译： 提供了用于清洁疏水性表面的方法，例如低K介电有机或无机表面以及半导体晶片的金属化表面。 该方法包括：（a）将表面活性剂溶液施用于表面; （b）擦洗表面; 和（c）使用去离子水旋转漂洗基材的表面以完成从表面去除任何污染物。 如果需要，表面活性剂溶液可以与化学增强剂混合，并且洗刷可以在刷系统中进行。 刷系统可以被配置为使用通过刷（TTB）技术来施加去离子水。 表面活性剂溶液可以使用滴灌技术或使用TTB技术来应用。

    Megasonic Precision Cleaning of Semiconductor Process Equipment Components and Parts
    5.
    发明申请
    Megasonic Precision Cleaning of Semiconductor Process Equipment Components and Parts 有权
    超声波精密清洗半导体工艺设备零部件

    公开(公告)号：US20130056041A1

    公开(公告)日：2013-03-07

    申请号：US13665898

    申请日：2012-10-31

    申请人： Yaobo Yin ,  Linda (Tong) Jiang

    发明人： Yaobo Yin ,  Linda (Tong) Jiang

    IPC分类号： B08B3/12

    CPC分类号： H01L21/67051 ,  B08B3/12 ,  B08B2203/0288 ,  H01L21/67057 ,  H01L21/67086

    摘要： Apparatuses are provided for cleaning a processing component using megasonic energy including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing component that is used in cleaning semiconductor, medical, or any other processing substrates. The apparatus includes a processing chamber having a carrier element that is configured to support the processing component. The carrier element includes a mechanism to flip the processing component within the processing chamber during cleaning. A fluid supply assembly supplies a fluid to a surface of the processing component and a beam assembly equipped with a megasonic transducer is used to provide high frequency megasonic acoustic energy to the fluid during cleaning.

    摘要翻译： 提供了用于使用包括兆声波箱，扫描兆声板，兆声波射流和兆声波扫描光束等的兆声波能量与选择性化学物质组合清洁处理部件的装置，以从处理部件的表面去除亚微米颗粒污染物， 用于清洁半导体，医疗或任何其他处理基板。 该装置包括具有被配置为支撑处理部件的载体元件的处理室。 载体元件包括在清洁期间翻转处理室内的处理部件的机构。 流体供应组件将流体供应到处理部件的表面，并且配备有兆声换能器的束组件用于在清洁期间向流体提供高频兆声声能。