公开(公告)号：US4501064A

公开(公告)日：1985-02-26

申请号：US299979

申请日：1981-09-08

申请人： Robert D. DiNozzi ,  Stanley R. Vancelette ,  Lionel E. Powell ,  George F. McLean, Jr. ,  Leon F. Sleger ,  Ronald C. Mason

发明人： Robert D. DiNozzi ,  Stanley R. Vancelette ,  Lionel E. Powell ,  George F. McLean, Jr. ,  Leon F. Sleger ,  Ronald C. Mason

IPC分类号： H05K13/00 ,  H05K13/04 ,  H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0469 ,  H05K13/0404 ,  Y10T29/4913 ,  Y10T29/53178

摘要： A machine for automatically placing chips or similar micro-electronic components on a substrate carried on an X-Y type table, the machine having means to supply components, means to convey the components, means to transfer the components from the supply source to the conveyor, the conveyor transporting the components to a placement head located above the substrate to place the component on the substrate. The machine can also include a station for applying an adhesive or similar means on the substrate to adhere the component on the substrate.

摘要翻译： 一种用于在XY型台上承载的基板上自动放置芯片或类似的微电子部件的机器，该机器具有供应部件的装置，用于传送部件的装置，用于将部件从供给源传送到输送机的装置， 将组件传送到位于衬底上方的放置头以将组件放置在衬底上。 机器还可以包括用于在基板上施加粘合剂或类似装置的站以将部件粘附在基板上。