Method of manufacturing a peripherally encapsulating unit
    1.
    发明授权
    Method of manufacturing a peripherally encapsulating unit 失效
    制造外围封装单元的方法

    公开(公告)号:US06210618B1

    公开(公告)日:2001-04-03

    申请号:US08980775

    申请日:1997-12-01

    Abstract: A peripherally encapsulated unit is manufactured by molding a peripheral encapsulation of a predetermined internal peripheral contour and internal peripheral size from hot polymeric material in a mold. The mold is opened and a member is positioned in internal relationship to the hot molded peripheral encapsulation. Thereafter, the hot molded peripheral encapsulation shrinks as it cools to reduce its internal peripheral size thereby unitizing the peripheral encapsulation with a peripheral edge portion of the member to form a peripherally encapsulated unit, such as a cook top, range door, “touch” control panel, or the like.

    Abstract translation: 通过在模具中模制来自热聚合材料的预定内周轮廓和内周尺寸的周边封装来制造外围封装的单元。 模具打开,并且构件与热成型的外围封装体内部关联。 此后,热成型的外围封装在其冷却时收缩以减小其内部周边尺寸,从而将外围封装与构件的外围边缘部分结合,以形成周边封装的单元,例如厨房顶部,范围门,“触摸”控制 面板等。

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