Polishing pad conditioning apparatus for wafer planarization process
    1.
    发明授权
    Polishing pad conditioning apparatus for wafer planarization process 失效
    用于晶片平面化处理的抛光垫调节装置

    公开(公告)号:US5216843A

    公开(公告)日:1993-06-08

    申请号:US950812

    申请日:1992-09-24

    CPC分类号: B24B53/017 B24B37/26

    摘要: An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.

    摘要翻译: 用于抛光形成在半导体衬底上的薄膜的改进的设备包括被抛光垫覆盖的可旋转工作台。 然后,桌子和衬垫相对于在抛光过程中被压向衬垫表面的衬底旋转。 提供了用于在衬底被抛光时在衬垫中产生多个凹槽的装置。 连续形成的凹槽有助于通过在衬底和衬垫之间引导浆料来促进抛光过程。