公开(公告)号：US06194032B1

公开(公告)日：2001-02-27

申请号：US09165366

申请日：1998-10-02

申请人： Lynne M. Svedberg ,  Kenneth C. Arndt ,  Michael J. Cima

发明人： Lynne M. Svedberg ,  Kenneth C. Arndt ,  Michael J. Cima

IPC分类号： B05D128

CPC分类号： C23C18/1651 ,  C23C18/161 ,  C23C18/1617 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44

摘要： A process for selective electroless plating onto a substrate, including providing a substrate having at least a catalytic surface; providing a plating gel comprising a carrier vehicle, an electroless platable metal compound capable of providing metal ions to the carrier vehicle at a specific pH, a reducing agent, and a polymeric thickening agent; applying said plating gel to the substrate surface in a selected pattern, and inducing plating of said metal on the substrate surface in said selected pattern. A stabilizer, and/or buffering and/or organic chelating agent, and/or surfactant and/or a humectant may be included in the plating gel. Preferably the metal compound is a gold complex, and the substrate is aluminum nitride.

摘要翻译： 一种用于在衬底上进行选择性化学镀的方法，包括提供至少具有催化表面的衬底; 提供包含载体载体的电镀凝胶，能够以特定pH提供载体载体的金属离子的化学镀金属化合物，还原剂和聚合物增稠剂; 以所选择的图案将所述电镀凝胶施加到所述基材表面，并且以所述选择的图案在所述基材表面上诱导所述金属的电镀。 稳定剂和/或缓冲和/或有机螯合剂，和/或表面活性剂和/或湿润剂可以包括在电镀凝胶中。 优选地，金属化合物是金络合物，并且衬底是氮化铝。