公开(公告)号：US20140291194A1

公开(公告)日：2014-10-02

申请号：US14231941

申请日：2014-04-01

Applicant: M KOREA CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun Ho MOON ,  Suk Hwan Kim ,  Dong Hun Lee ,  Heon Kwon Jeong

IPC: B65D81/127 ,  B29C45/14

CPC classification number: B65D81/127 ,  B29C44/1271 ,  B29C45/14065 ,  B29C45/14631 ,  B29C2045/14155 ,  B29K2025/06 ,  B29K2225/06 ,  B65D81/113

Abstract: Disclosed are a packing buffer having enhanced manufacture efficiency, high strength, and eco-friendly properties and a manufacturing method thereof. The packing buffer includes reinforcement sheet provided at the exterior of the packing buffer for increase in strength of the packing buffer. Injection molding of the packing buffer is implemented in a state in which the reinforcement sheet is inserted in a mold.

Abstract translation: 公开了具有提高的制造效率，高强度和环保性的包装缓冲剂及其制造方法。 包装缓冲器包括设置在包装缓冲器外部的增强片，用于增加包装缓冲器的强度。 包装缓冲液的注射成型是在将增强片插入模具中的状态下进行的。