-
公开(公告)号：US20190248050A1
公开(公告)日：2019-08-15
申请号：US16046444
申请日：2018-07-26
IPC分类号： B29C45/14
CPC分类号： B29C45/14065 , B29C2045/14147
摘要： A positioning module and a mold insert thereof are provided. The positioning module for positioning an insert includes a lower mold disposed relatively below, an upper mold disposed relatively above and at least one mold insert. The mold insert includes an insert body, a positioning hole, at least one roller guide slot and at least one roller set. The positioning hole is formed in the insert body for the insert to pass through to be positioned. The roller guide slot is disposed at the insert body and partially communicates with the positioning hole. The roller set is disposed in the corresponding roller guide slot, and rolls in circular motion. When at a position where the corresponding roller guide slot communicates with the positioning hole, the roller set protrudes to the positioning hole to be in rolling contact with at least one side of the insert.
-
2.发明申请公开(公告)号：US20190217512A1
公开(公告)日：2019-07-18
申请号：US16026748
申请日：2018-07-03
发明人： KY Huang , Kenny Peng
IPC分类号： B29C45/14
CPC分类号： B29C45/14065 , B29C45/14377 , B29C45/14639 , B29C2045/14131 , B29K2705/00 , B29K2995/0005 , B29L2031/36
摘要： A manufacturing method of an assembly injection molded article includes: preparing a first injection molded member; inserting insertion members into insertion holes of the first injection molded member to form an intermediate assembly; placing the intermediate assembly on a mold core of an injection molding mold, in which the mold core has in-mold insertion holes, and the insertion members are inserted into the in-mold insertion holes; and forming a second injection molded member on a side of the first injection molded member opposite to the mold core through the injection molding mold such that the first injection molded member, the insertion members, and the second injection molded member are assembled together. The present disclosure also provides an assembly injection molded article. The advantage of the present disclosure is to avoid burrs formed at seams between the insertion members and an appearance surface of the assembly injection molded article.
-
公开(公告)号：US20180354171A1
公开(公告)日：2018-12-13
申请号：US15775711
申请日：2016-11-10
申请人： JTEKT CORPORATION
CPC分类号： B29C45/14065 , B29C33/12 , B29C45/14 , B29C45/26 , B29C2045/14122 , B29L2031/32 , B60B27/0068 , B60B27/0073 , B60B35/02 , B60B2310/204 , B60B2360/348 , B60B2900/511 , F16C33/76
摘要： A production method for a cover attached to an outer ring of a hub unit including procedures as follows. A nut is supported by a first protrusion of a first mold. By a second protrusion of a second mold, a core bar including a cylindrical section to be inserted into the outer ring is supported. A resin material is injected into a cavity formed by the first mold and the second mold to form a cover including a nut and a core bar. The cover is detached from the second mold by moving the first mold in a direction of being separated from the second mold. After this, the cover is detached from the first mold by pushing out the cover in a die matching direction with a pin disposed in the first mold.
-
公开(公告)号：US20180319554A1
公开(公告)日：2018-11-08
申请号：US16032389
申请日：2018-07-11
IPC分类号： B65D47/20 , B65D83/00 , B29C45/14 , B29C49/04 , B29C49/06 , B65D25/14 , B65D1/02 , B65B3/02 , B29C49/20 , B29L31/00 , B65D83/62
CPC分类号： B65D47/2018 , B29C45/14 , B29C45/14065 , B29C45/14336 , B29C49/04 , B29C49/06 , B29C49/20 , B29C2049/2008 , B29C2049/2026 , B29C2049/2047 , B29L2031/712 , B65B3/022 , B65D1/023 , B65D25/14 , B65D83/0055 , B65D83/0061 , B65D83/62
摘要： The present disclosure provides a container and a process for producing the container. In an embodiment, the process includes placing a sleeve bag on valve assembly (SBoV) in a blow mold apparatus. The blow mold apparatus has two opposing and movable molds. The SBoV has a valve seat. The process includes extending a parison of flowable polymeric material around the SBoV and between the opposing molds. The process includes moving the opposing molds to a closed position and pressing an upstream portion of the parison against the valve seat. The process includes blow molding a downstream portion of the parison into a container-shape within the closed mold. The process includes forming a container with the valve seat melt bonded to a neck portion of the container.
-
公开(公告)号：US20180272581A1
公开(公告)日：2018-09-27
申请号：US15912797
申请日：2018-03-06
发明人： Yutaka Uematsu
CPC分类号： B29C45/0046 , B29C45/14065 , B29C45/14418 , B29C45/14631 , B29C45/2606 , B29K2705/00
摘要： An insert member includes a bending portion, a first portion, and a second portion. The bending portion is interposed between the first portion and the second portion. A device for integrally molding the insert member and resin includes a holding portion configured to securely hold the first portion, a surface configured to contact a bottom surface of the second portion, and a gate configured to inject resin from a position nearer to the first portion than to the second portion, into a cavity. The cavity has a shape which causes a flow speed of the resin in a space above the second portion to be higher than a flow speed of the resin in a space at a side of the second portion.
-
公开(公告)号：US20180257274A1
公开(公告)日：2018-09-13
申请号：US15454280
申请日：2017-03-09
发明人： Peter T. Bucco
CPC分类号： B29C45/14065 , B29C45/0025 , B29C45/14598 , B29C45/4407 , B29C2045/0037 , B29C2045/14131 , B29K2083/00 , B29K2995/007 , B29L2031/34 , F16J15/102 , F16J15/108 , H01R43/005 , H01R43/18
摘要： A method of forming a resilient seal about a work piece is presented. The method includes the steps of providing a work piece defining a rib circumferentially protruding from an outer surface about a longitudinal axis of the work piece and providing a mold. The mold defines a first cavity configured to receive the work piece, a second cavity circumferentially extending about the longitudinal axis of the work piece and in communication with the first cavity, and a port in communication with the second cavity. The method further includes the steps of inserting the work piece within the first cavity such the rib is circumferentially in intimate contact with an inner surface of the first cavity, introducing a curable resilient material into the port, thereby filling the second cavity with the resilient material, curing the resilient material, and then removing the work piece from the mold.
-
7.发明申请公开(公告)号：US20180186036A1
公开(公告)日：2018-07-05
申请号：US15740105
申请日：2016-07-01
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Toshiya HIROOKA , Kouji FUKUMOTO , Daisuke HASHIMOTO , Jisung KIM , Kenji MIYAMOTO , Mitsuru HIROSE , Hitoshi HORIO
CPC分类号： B29C33/12 , B29C45/14065 , B29C45/14639 , B29C2045/14139 , B29L2031/36 , H01R4/022 , H01R4/183 , H01R4/70 , H01R11/12 , H01R13/40 , H01R43/0214 , H01R43/24
摘要： When forming molded resin on a terminal-equipped conductive wire, cases where resin inside the mold for insert-molding leaks out from the mold are suppressed. A smooth portion having a smooth outer circumferential surface is formed in a conductive wire of a terminal-equipped conductive wire (smooth portion formation step (S2)). Furthermore, a molded resin member that covers the terminal connection portion is formed in a state where the terminal connection portion provided is inserted into an insert-molding mold, and a portion of the conductive wire that extends from a metal terminal is exposed to the outside through an opening portion of the mold (insert-molding step (S3)). The outer shape of the smooth portion is a shape that corresponds to the opening shape of the opening portion of the mold. In the insert-molding step (S3), the interior of the mold is filled with a resin in a state where the inner circumferential surface of the opening portion of the mold is in contact with the outer circumferential surface of the smooth portion.
-
公开(公告)号：US20180117813A1
公开(公告)日：2018-05-03
申请号：US15341733
申请日：2016-11-02
CPC分类号： B29C45/43 , B29C45/14065 , B29C45/14336 , B29C45/14639 , B29C45/1701 , B29C45/2602 , B29K2105/20 , B29K2995/0005 , B29L2031/34 , H01L21/565 , H01L23/293
摘要： The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.
-
公开(公告)号：US20180085976A1
公开(公告)日：2018-03-29
申请号：US15541652
申请日：2016-06-03
发明人： Yuguang FAN , Shichao WANG , Jian LI , Jingpeng LI , Zhenyu XIE
CPC分类号： B29C45/14065 , B29C45/0055 , B29C45/2608 , B29C45/40 , B29C2045/0058 , B29C2045/14114 , B29C2045/4078 , G02F1/133308 , G02F1/1339 , G02F2001/133311 , G02F2201/50 , G02F2201/501 , G02F2201/503 , G02F2202/22
摘要： A display panel, a manufacturing method thereof, a display device and a mould are disclosed. The display panel includes a first substrate and a second substrate disposed opposite to each other; a sealant disposed in a non-display region between the first substrate and the second substrate; and a protection structure disposed on a side surface of the display panel, wherein a material of forming the protection structure is an insulating material with viscosity; and a height of the protection structure in a direction perpendicular to surfaces of the first substrate and the second substrate is not greater than a thickness of the display panel.
-
10.发明申请公开(公告)号：US20180078760A1
公开(公告)日：2018-03-22
申请号：US15719487
申请日：2017-09-28
发明人： Henry Lee , Alexander Hwu
IPC分类号： A61N1/05 , B29C45/14 , A61N1/36 , B23K26/38 , B23K26/242 , B23K26/40 , B23K103/18 , B29L31/00 , B23K103/14
CPC分类号： A61N1/0558 , A61N1/36007 , A61N1/3606 , B23K26/242 , B23K26/38 , B23K26/40 , B23K2103/14 , B23K2103/18 , B23K2103/26 , B29C45/14065 , B29C45/14598 , B29C45/14778 , B29L2031/753
摘要： Anchoring devices and methods for affixing an implanted lead of a neurostimulation system at a target location in a patient are provided herein. Such anchoring devices includes a helical body having a plurality of tines extending laterally outward from the lead when deployed that engage tissue to inhibit axial movement of the implanted lead. The plurality of tines are biased towards the laterally extended deployed configuration and fold inward towards the lead to a delivery configuration to facilitate delivery of the lead through a sheath. The tines may be angled in a proximal direction or in both proximal and distal directions and may include various features to assist in visualization and delivery of the lead. The anchor may be formed according to various methods, including laser cutting of a tubular section along with heat or reflow to set the material with the anchor in the deployed configuration and injection molding.
-
-
-
-
-
-
-
-
-
搜索结果
1412 条记录 (耗时 0.045 秒)