公开(公告)号：US06542035B2

公开(公告)日：2003-04-01

申请号：US09750927

申请日：2000-12-28

申请人： Dean L. Cook ,  Michael R. Lyons ,  John Martin Peitz ,  Edwin Jack Stanfield

发明人： Dean L. Cook ,  Michael R. Lyons ,  John Martin Peitz ,  Edwin Jack Stanfield

IPC分类号： H03F360

CPC分类号： H03F3/602

摘要： A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.

公开(公告)号：US1362176A

公开(公告)日：1920-12-14

申请号：US36588220

申请日：1920-03-15

申请人： MARTIN PEITZ

发明人： MARTIN PEITZ

IPC分类号： F16C9/06

CPC分类号： F16C9/06