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1.发明授权公开(公告)号：US09512533B2
公开(公告)日：2016-12-06
申请号：US14715608
申请日：2015-05-19
发明人： Yu-Cheng Su , Chun-Yang Chang
摘要： The electroplating equipment disposes a hollow first ring between a first mold and a through hole of a workpiece, and a hollow second ring between a second mold and the through hole of the workpiece, such that the first ring and the second ring provide substantially equivalent channel as the openings of the through hole when the first mold and the second mold are set to hold tight the workpiece. The first ring and the second ring, along with an injection channel of the first mold and a recycling channel of the second mold and the through hole of the workpiece, form a seamless flow channel for an electroplating fluid to flow and be electroplated on the wall of the through hole.
摘要翻译： 电镀设备在第一模具和工件的通孔之间设置中空的第一环，并且在第二模具和工件的通孔之间设置中空的第二环，使得第一环和第二环提供基本相等的通道 当第一模具和第二模具被设置成夹持工件时，作为通孔的开口。 第一环和第二环以及第一模具的注入通道和第二模具的再循环通道和工件的通孔形成用于电镀流体流动并电镀在壁上的无缝流动通道 的通孔。
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2.发明申请ELECTROPLATING EQUIPMENT CAPABLE OF GOLD-PLATING ON A THROUGH HOLE OF A WORKPIECE 有权电镀设备可以在一个工件的一个通孔上镀金公开(公告)号：US20160032476A1
公开(公告)日：2016-02-04
申请号：US14715608
申请日：2015-05-19
发明人： Yu-Cheng Su , Chun-Yang Chang
摘要： The electroplating equipment disposes a hollow first ring between a first mold and a through hole of a workpiece, and a hollow second ring between a second mold and the through hole of the workpiece, such that the first ring and the second ring provide substantially equivalent channel as the openings of the through hole when the first mold and the second mold are set to hold tight the workpiece. The first ring and the second ring, along with an injection channel of the first mold and a recycling channel of the second mold and the through hole of the workpiece, form a seamless flow channel for an electroplating fluid to flow and be electroplated on the wall of the through hole.
摘要翻译： 电镀设备在第一模具和工件的通孔之间设置中空的第一环，并且在第二模具和工件的通孔之间设置中空的第二环，使得第一环和第二环提供基本相等的通道 当第一模具和第二模具被设置成夹持工件时，作为通孔的开口。 第一环和第二环以及第一模具的注入通道和第二模具的再循环通道和工件的通孔形成用于电镀流体流动并电镀在壁上的无缝流动通道 的通孔。
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