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公开(公告)号：US20090176441A1
公开(公告)日：2009-07-09
申请号：US12351290
申请日：2009-01-09
申请人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
发明人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
CPC分类号： B24B53/017
摘要： A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
摘要翻译： 一种用于抛光半导体晶片的系统。 该系统包括具有用于抛光晶片的可旋转抛光垫的抛光装置。 修整装置安装在抛光垫附近，用于修整抛光垫。 修整装置包括可与抛光垫接合的修整构件。 清洁装置安装在抛光垫附近，用于从抛光垫去除颗粒和化学物质。 该系统包括用于控制敷料装置和清洁装置的控制器。
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公开(公告)号：US07846007B2
公开(公告)日：2010-12-07
申请号：US12351290
申请日：2009-01-09
申请人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
发明人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
CPC分类号： B24B53/017
摘要： A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
摘要翻译： 一种用于抛光半导体晶片的系统。 该系统包括具有用于抛光晶片的可旋转抛光垫的抛光装置。 修整装置安装在抛光垫附近，用于修整抛光垫。 修整装置包括可与抛光垫接合的修整构件。 清洁装置安装在抛光垫附近，用于从抛光垫去除颗粒和化学物质。 该系统包括用于控制敷料装置和清洁装置的控制器。
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公开(公告)号：US07846006B2
公开(公告)日：2010-12-07
申请号：US11771495
申请日：2007-06-29
申请人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
发明人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
CPC分类号： B24B53/017
摘要： A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
摘要翻译： 用于修整抛光垫的修整装置包括可与抛光垫接合的修整构件。 修整装置适于在修整构件沿着抛光垫径向移动时改变由修整构件施加在抛光垫上的力的量。 用于控制敷料装置的控制器具有基于被测量的抛光晶片的径向轮廓可选择的预编程配方。
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