发明授权
- 专利标题： Dressing a wafer polishing pad
- 专利标题（中）： 打磨抛光垫
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申请号： US11771495申请日： 2007-06-29
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公开(公告)号： US07846006B2公开(公告)日： 2010-12-07
- 发明人: Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
- 申请人： Mark G. Stinson , Madhavan S. Esayanur , Dennis Buese , Emanuele Corsi , Ezio Bovio , Antonio Maria Rinaldi , Larry Flannery
- 申请人地址： US MO St. Peters
- 专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人： MEMC Electronic Materials, Inc.
- 当前专利权人地址： US MO St. Peters
- 代理机构： Armstrong Teasdale LLP
- 主分类号： B24B49/00
- IPC分类号： B24B49/00 ; B24B51/00
摘要：
A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
公开/授权文献
- US20080009231A1 Dressing a Wafer Polishing Pad 公开/授权日：2008-01-10
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