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1.发明授权Method of closing a mould before at least partly filling a cavity of this mould with a solidifiable liquid 失效在用可固化液体至少部分地填充该模具的空腔之前关闭模具的方法
公开(公告)号：US5397528A
公开(公告)日：1995-03-14
申请号：US96573
申请日：1993-07-22
CPC分类号： B29C45/2608 , B29C45/26 , B29C45/6721 , B29C45/68
摘要： A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.
摘要翻译： 因此，一种关闭模具和压力机的方法，由此通过机械非流体驱动器，第一模具部件通过第一相对较大的位移朝向第二模具部件移动。 然后通过包括气动驱动的液压系统的流体系统将模具部件彼此压紧以提供相对较高的模具压力。 驱动和从动销通过转盘选择性地联接到液压系统，用于在循环的按压部分期间选择性地将模具部件耦合到液压系统。 该方法和压机特别适用于封装电气部件。
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公开(公告)号：US5252053A
公开(公告)日：1993-10-12
申请号：US710264
申请日：1991-06-04
CPC分类号： B29C45/2608 , B29C45/26 , B29C45/6721 , B29C45/68
摘要： A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.
摘要翻译： 因此，一种关闭模具和压力机的方法，由此通过机械非流体驱动器，第一模具部件通过第一相对较大的位移朝向第二模具部件移动。 然后通过包括气动驱动的液压系统的流体系统将模具部件彼此压紧以提供相对较高的模具压力。 驱动和从动销通过转盘选择性地联接到液压系统，用于在循环的按压部分期间选择性地将模具部件耦合到液压系统。 该方法和压机特别适用于封装电气部件。
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公开(公告)号：US5158780A
公开(公告)日：1992-10-27
申请号：US710268
申请日：1991-06-04
CPC分类号： B29C45/021 , Y10S425/228
摘要： A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.
摘要翻译： 用于同时封装多个电子部件的装置设置有锁定机构，其中成型周期具有两相，即在第一转移阶段，在该第一转移阶段期间，用于将熔融树脂注入到封装腔中的柱塞被锁定和驱动， 控制速度，随后是第二固化阶段，在此期间，柱塞弹簧加载，解锁和静止，并且受到相同的转移相的最大压力。 以这种方式防止了产品的损坏，同时减少了循环时间，并且获得的产品具有均匀和平滑的外观。
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