公开(公告)号：US20100131211A1

公开(公告)日：2010-05-27

申请号：US12631600

申请日：2009-12-04

Applicant: John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett ,  Sorin V. Teles ,  Don W. Wallentine

Inventor： John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett ,  Sorin V. Teles ,  Don W. Wallentine

IPC: G01N3/08

CPC classification number: G01N3/60 ,  G01N19/04 ,  G01N2203/0617

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property. Structures having one or more sensors bonded thereto and an associated sensing system for determining bond integrity between the one or more sensors and the structure are also disclosed.

Abstract translation: 公开了用于确定结构和传感器之间的结合量的方法和系统。 方法可以包括执行与结合到结构的传感器相关联的过程，并响应于该过程产生测量数据。 该方法还可以包括将测量的数据与已知参考数据进行比较，以确定传感器和结构之间的结合的完整性。 系统可以包括传感器系统，其包括结合到结构的至少一个传感器。 系统还可以包括感测系统，其被配置为启动对至少一个传感器的一个或多个刺激的应用并且监视与所述至少一个传感器相关联的属性。 感测系统还可以被配置为基于所监视的属性来确定所述至少一个传感器和所述结构之间的结合量。 还公开了具有结合到其上的一个或多个传感器的结构以及用于确定一个或多个传感器和结构之间的接合完整性的相关感测系统。

公开(公告)号：US20090229372A1

公开(公告)日：2009-09-17

申请号：US12046553

申请日：2008-03-12

Applicant: John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett

Inventor： John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett

IPC: G01N3/08

CPC classification number: G01N3/60 ,  G01N19/04 ,  G01N2203/0617

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract translation: 公开了用于确定结构和传感器之间的结合量的方法和系统。 方法可以包括加热可操作地耦合到测量电路的传感器，然后随着时间测量输出信号。 该方法还可以包括从输出信号确定传感器和结构之间剩余的粘合完整性的百分比。 系统可以包括具有可操作地耦合到感测系统的传感器的测量电路。 感测系统可以被配置为对传感器施加热冲击并且随后测量测量电路的输出信号。 感测系统还可以被配置用于从输出信号确定传感器和结构之间的结合量。

公开(公告)号：US08708555B2

公开(公告)日：2014-04-29

申请号：US12631600

申请日：2009-12-04

Applicant: John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett ,  Sorin V. Teles ,  Don W. Wallentine

Inventor： John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett ,  Sorin V. Teles ,  Don W. Wallentine

IPC: G01N25/72 ,  G01K11/00

CPC classification number: G01N3/60 ,  G01N19/04 ,  G01N2203/0617

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include performing a process associated with a sensor bonded to a structure and generating measured data in response to the process. The method may further include comparing the measured data to known reference data to determine integrity of a bond between the sensor and the structure. A system may include a sensor system including at least one sensor bonded to a structure. The system may further include a sensing system configured to initiate an application of one or more stimuli to the at least one sensor and monitor a property associated with the at least one sensor. The sensing system may further be configured to determine an amount of bond between the at least one sensor and the structure based on the monitored property. Structures having one or more sensors bonded thereto and an associated sensing system for determining bond integrity between the one or more sensors and the structure are also disclosed.

Abstract translation: 公开了用于确定结构和传感器之间的结合量的方法和系统。 方法可以包括执行与结合到结构的传感器相关联的过程，并响应于该过程产生测量数据。 该方法还可以包括将测量的数据与已知参考数据进行比较，以确定传感器和结构之间的结合的完整性。 系统可以包括传感器系统，其包括结合到结构的至少一个传感器。 系统还可以包括感测系统，其被配置为启动对至少一个传感器的一个或多个刺激的应用并且监视与所述至少一个传感器相关联的属性。 感测系统还可以被配置为基于所监视的属性来确定所述至少一个传感器和所述结构之间的结合量。 还公开了具有结合到其上的一个或多个传感器的结构和用于确定一个或多个传感器和结构之间的接合完整性的相关联的传感系统。

公开(公告)号：US08147135B2

公开(公告)日：2012-04-03

申请号：US12046553

申请日：2008-03-12

Applicant: John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett

Inventor： John L. Shipley ,  Jerry W. Jenson ,  Mark R. Eggett

IPC: G01N25/00 ,  G01N17/00

CPC classification number: G01N3/60 ,  G01N19/04 ,  G01N2203/0617

Abstract: Methods and systems are disclosed for determining an amount of bond between a structure and sensor. A method may include heating a sensor that is operably coupled to a measuring circuit and then measuring an output signal over time. The method may further include determining, from the output signal, a percentage of bond integrity remaining between the sensor and the structure. A system may include a measurement circuit having a sensor operably coupled to a sensing system. The sensing system may be configured for applying a thermal shock to the sensor and subsequently measuring an output signal of the measuring circuit. The sensing system may also be configured for determining, from the output signal, an amount of bond between the sensor and the structure.

Abstract translation: 公开了用于确定结构和传感器之间的结合量的方法和系统。 方法可以包括加热可操作地耦合到测量电路的传感器，然后随着时间测量输出信号。 该方法还可以包括从输出信号确定传感器和结构之间剩余的粘合完整性的百分比。 系统可以包括具有可操作地耦合到感测系统的传感器的测量电路。 感测系统可以被配置为对传感器施加热冲击并且随后测量测量电路的输出信号。 感测系统还可以被配置用于从输出信号确定传感器和结构之间的结合量。

公开(公告)号：US06951137B2

公开(公告)日：2005-10-04

申请号：US09897003

申请日：2001-07-02

Applicant: Douglas E. Smith ,  Peter D. Totman ,  Randy L. Everton ,  Paul A. St. Jean ,  Marvin D. Bunderson ,  Mark R. Eggett ,  Randy L. Borgstrom

Inventor： Douglas E. Smith ,  Peter D. Totman ,  Randy L. Everton ,  Paul A. St. Jean ,  Marvin D. Bunderson ,  Mark R. Eggett ,  Randy L. Borgstrom

IPC: G01L1/00 ,  F16B31/02 ,  G01L1/22 ,  G01L5/00 ,  G01N3/20

CPC classification number: G01L1/2225

Abstract: An instrument pin member is provided that is capable of measuring bending moments and optionally of measuring bending and axial strain in real or near real time. The instrumented pin member includes a pin member body disposed about a pin member axis, wherein the pin member body includes a bending portion. A sensing device is positioned at the pin member body within the bending portion for sensing a bending strain in the bending portion exclusive of a net axial strain, and for outputting a sensor measurement signal representative of the bending strain. A sensor measurement signal output device is provided for outputting the sensor measurement signal from the sensing device. A related system includes a plurality of pin members, among other things. Related methods also are disclosed.

Abstract translation: 提供了一种能够测量弯矩并且可选地实际或接近实时地测量弯曲和轴向应变的仪器销构件。 所述装置销构件包括围绕销构件轴线设置的销构件主体，其中所述销构件主体包括弯曲部。 感测装置位于弯曲部分内的销构件主体处，用于感测除了净轴向应变之外的弯曲部分中的弯曲应变，并且用于输出表示弯曲应变的传感器测量信号。 提供传感器测量信号输出装置，用于从感测装置输出传感器测量信号。 相关的系统包括多个销构件，其中包括多个销构件。 还公开了相关方法。