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    Buffer compositions
    1.
    发明授权
    Buffer compositions 有权
    缓冲剂组合物

    公开(公告)号：US07700008B2

    公开(公告)日：2010-04-20

    申请号：US11476487

    申请日：2006-06-28

    申请人： Che-Hsiung Hsu ,  Hjalti Skulason ,  Mark T. Martello

    发明人： Che-Hsiung Hsu ,  Hjalti Skulason ,  Mark T. Martello

    IPC分类号： H01B1/12 ,  H01B1/02

    CPC分类号： H01L51/5088 ,  B82Y20/00 ,  B82Y30/00 ,  C08G61/124 ,  C08G61/126 ,  C08G73/0266 ,  C08L65/00 ,  C08L79/04 ,  H01L51/442 ,  H01L2251/305 ,  H01L2251/306 ,  H01L2251/5369 ,  Y02E10/549 ,  C08L2666/04

    摘要： Buffer compositions comprising semiconductive oxide particles and at least one of (a) a fluorinated acid polymer and (b) a semiconductive polymer doped with a fluorinated acid polymer are provided. Semiconductive oxide particles include metal oxides and bimetallic oxides. Acid polymers are derived from monomers or comonomers of polyolefins, polyacrylates, polymethacrylates, polyimides, polyamides, polyaramids, polyacrylamides, polystyrenes. The polymer backbone, side chains, pendant groups or combinations thereof may be fluorinated or highly fluorinated. Semiconductive polymers include polymers or copolymers derived from thiophenes, pyrroles, anilines, and polycyclic heteroaromatics. Methods for preparing buffer compositions are also provided.

    摘要翻译： 提供了包含半导体氧化物颗粒和（a）氟化酸聚合物和（b）掺杂有氟化酸聚合物的半导体聚合物中的至少一种的缓冲剂组合物。 半导体氧化物颗粒包括金属氧化物和双金属氧化物。 酸性聚合物衍生自聚烯烃，聚丙烯酸酯，聚甲基丙烯酸酯，聚酰亚胺，聚酰胺，聚芳酰胺，聚丙烯酰胺，聚苯乙烯的单体或共聚单体。 聚合物主链，侧链，侧基或其组合可以是氟化的或高度氟化的。 半导体聚合物包括衍生自噻吩，吡咯，苯胺和多环杂芳族化合物的聚合物或共聚物。 还提供了制备缓冲剂组合物的方法。

    Conductive polymer compositions
    5.
    发明授权
    Conductive polymer compositions 失效
    导电聚合物组合物

    公开(公告)号：US08147719B2

    公开(公告)日：2012-04-03

    申请号：US11756985

    申请日：2007-06-01

    申请人： Hjalti Skulason ,  Mark T. Martello ,  Che-Hsiung Hsu

    发明人： Hjalti Skulason ,  Mark T. Martello ,  Che-Hsiung Hsu

    IPC分类号： H01B1/00 ,  C08G73/06

    CPC分类号： H01B1/127 ,  C08G61/123 ,  C08L33/16 ,  C08L65/00 ,  H01B1/122 ,  H01B1/124 ,  H01B1/128 ,  H01L51/0035 ,  C08L2666/04

    摘要： Electrically conductive polymer compositions are provided. The compositions are dispersed in an aqueous liquid medium having an oxygen content less than 10% of the saturated level. The compositions can be an electrically conductive polymer doped with a fluorinated acid polymer, an electrically conductive polymer in admixture with a fluorinated acid polymer, or mixtures thereof. The conductive polymer composition has a conductivity that changes by less than 10% in 30 days.

    摘要翻译： 提供导电聚合物组合物。 将组合物分散在氧含量低于饱和水平的10％的含水液体介质中。 组合物可以是掺杂有氟化酸聚合物的导电聚合物，与氟化酸聚合物混合的导电聚合物，或其混合物。 导电聚合物组合物的导电率在30天内变化小于10％。

    CHEWING GUMS AND GUM BASES COMPRISING MULTI-BLOCK COPOLYMERS
    6.
    发明申请
    CHEWING GUMS AND GUM BASES COMPRISING MULTI-BLOCK COPOLYMERS 有权
    包括多嵌段共聚物的CHEWING GUMS和GUM BASES

    公开(公告)号：US20140161931A1

    公开(公告)日：2014-06-12

    申请号：US14003998

    申请日：2012-03-09

    申请人： Leslie D. Morget ,  Michael S. Haas ,  Marc A. Hillmyer ,  Wilhelm Risse ,  Frank S. Bates ,  Mark T Martello ,  Sangwoo Lee

    发明人： Leslie D. Morget ,  Michael S. Haas ,  Marc A. Hillmyer ,  Wilhelm Risse ,  Frank S. Bates ,  Mark T Martello ,  Sangwoo Lee

    IPC分类号： A23G4/08

    CPC分类号： A23G4/08 ,  A23G4/123 ,  C08G63/66 ,  C08G81/00 ,  C12C12/00

    摘要： Chewing gums and chewing gum bases which are cud-forming and chewable at mouth temperature contains a multi-block copolymer having at least two repeating sequences of at least two different polymeric blocks having at least three monomer units each. The multi-block copolymer optionally includes linking units and may be formulated to have non-covalent crosslinking between the copolymer chains. The multi-block copolymer is optionally plasticized with a compatible di-block copolymer to function as an elastomer system in the gum base. Characteristics of the multi-block copolymers can be selected to produce gum bases and chewing gums having desired properties. In some cases, chewed cuds formed from the gum bases may exhibit improved removability from environmental surfaces to which they may become undesirably attached.

    摘要翻译： 咀嚼口香糖和口香糖咀嚼口香糖基质含有多嵌段共聚物，其具有至少两个具有至少三个单体单元的至少两个不同聚合物嵌段的重复序列。 多嵌段共聚物任选地包括连接单元，并且可以配制成在共聚物链之间具有非共价交联。 多嵌段共聚物任选地用相容的二嵌段共聚物增塑，用作胶基中的弹性体体系。 可以选择多嵌段共聚物的特性来生产具有所需性质的胶基和口香糖。 在一些情况下，由胶基形成的咀嚼嚼可以表现出从它们可能变得不期望地附着的环境表面的改进的可除去性。