Method and process to laminate substrates using an adhesive tape

    公开(公告)号:US11077651B2

    公开(公告)日:2021-08-03

    申请号:US16666929

    申请日:2019-10-29

    Applicant: MAROTECH INC.

    Abstract: The present invention discloses a method and process to laminate packaging substrates using an adhesive tape. The tape has a first heat activated adhesive which is activatable at a first temperature and a second heat activated adhesive which is activatable at a second temperature and both of which are alternatively coated on at least one surface of the tape. The method consists of laminating this aforementioned tape to a packaging substrate by following the process of: placing this tape in or on a laminating machine over the packaging substrate, heating the tape at least to the second temperature while making contact with the packaging substrate, cooling the packaging laminate until the second heat activated adhesive is set and cutting a predetermined portion of the packaging laminate before a second adhesive occurs between the tape and the packaging laminate.

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