公开(公告)号：US20050224254A1

公开(公告)日：2005-10-13

申请号：US11052817

申请日：2005-02-09

申请人： Shinichi Endoh ,  Masaharu Iwasa ,  Hideyuki Ito

发明人： Shinichi Endoh ,  Masaharu Iwasa ,  Hideyuki Ito

IPC分类号： H05K3/00 ,  B05C11/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/12 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40

CPC分类号： H05K1/117 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/207 ,  H05K3/28 ,  H05K3/403 ,  H05K2201/035 ,  H05K2201/09736 ,  H05K2203/0113

摘要： A film having a recess provided in a surface of the film is provided. The recess included a first portion and a second portion connected with the first portion. The second portion is deeper than the first portion. The recess in the film is filled with a conductive paste so as to fill the first portion and the second portion of the recess with a first portion and a second portion of the conductive paste, respectively. Then, the surface of the film is attached onto a surface of a substrate. The conductive paste is transferred to the surface of the substrate by removing the film from the substrate so as to transfer the first portion and the second portion of the conductive paste to the surface of the substrate. The transferred first portion and the transferred second portion of the conductive paste are baked to provide a first portion and the second portion of a conductor pattern, respectively. An insulating layer is provided on the conductor pattern. Then, the substrate, the insulating layer, and the conductor pattern are cut along a first border extending across the second portion of the conductor pattern, thus providing an electronic device. In this method, the side electrode is formed simultaneously to the cutting of the substrate.

摘要翻译： 提供了具有设置在膜的表面中的凹部的膜。 凹部包括与第一部分连接的第一部分和第二部分。 第二部分比第一部分更深。 膜中的凹部填充有导电膏，以分别用导电膏的第一部分和第二部分填充凹部的第一部分和第二部分。 然后，将膜的表面附着到基板的表面上。 通过从基板去除膜将导电浆料转移到基板的表面，以将导电浆料的第一部分和第二部分转移到基板的表面。 导电浆料的转移的第一部分和转移的第二部分被烘烤以分别提供导体图案的第一部分和第二部分。 绝缘层设置在导体图案上。 然后，沿着延伸穿过导体图案的第二部分的第一边界切割基板，绝缘层和导体图案，从而提供电子设备。 在该方法中，侧面电极与基板的切割同时形成。

公开(公告)号：US08693151B2

公开(公告)日：2014-04-08

申请号：US13146423

申请日：2010-01-28

申请人： Masaharu Iwasa ,  Tomohiro Yamada

发明人： Masaharu Iwasa ,  Tomohiro Yamada

IPC分类号： H02H9/04

CPC分类号： H03H7/0107 ,  H03H7/427

摘要： A differential transmission circuit is capable of realizing a high resistance to electrostatic breakdown without deteriorating a transmission signal. The differential transmission circuit includes ESD protection elements connected between transmission lines and a ground, respectively, a common mode filter in which an inductor element is serially connected between transmission lines, and an inductor element serially connected between transmission lines are magnetically coupled to each other, ESD protection diodes of which cathodes are connected to transmission, respectively, and anodes thereof connected to grounds, respectively, and resistors of which one side terminals are connected to transmission lines, respectively, and the other side terminals thereof are connected to transmission lines, respectively. Resistance values of the resistors are set to 10 to 15 ohms, respectively, electrostatic capacitance values of the ESD protection elements are less than 0.3 pF, respectively, and a clip voltage of each of the ESD protection diodes is set to a value less than 10 V.

摘要翻译： 差分传输电路能够实现高抗静电击穿，而不会降低传输信号。 差分传输电路分别包括连接在传输线和接地之间的ESD保护元件，其中电感器元件串联连接在传输线之间的共模滤波器，串联连接在传输线之间的电感器元件彼此磁耦合， 分别连接到传输的ESD保护二极管和分别连接到接地的阳极和分别连接到传输线的电阻器和其它侧端子分别连接到传输线 。 电阻器的电阻值分别设定为10〜15欧姆，ESD保护元件的静电电容值分别小于0.3pF，并且每个ESD保护二极管的钳位电压设定为小于10的值 五

公开(公告)号：US20110279935A1

公开(公告)日：2011-11-17

申请号：US13146423

申请日：2010-01-28

申请人： Masaharu Iwasa ,  Tomohiro Yamada

发明人： Masaharu Iwasa ,  Tomohiro Yamada

IPC分类号： H02H9/04

CPC分类号： H03H7/0107 ,  H03H7/427

摘要： There is disclosed a differential transmission circuit capable of realizing a high resistance to electrostatic breakdown without deteriorating a transmission signal. The differential transmission circuit includes ESD protection elements 5 and 6 connected between transmission lines 3 and 4 and a ground, respectively, a common mode filter 9 in which an inductor element 7 serially connected between the transmission lines 3 and a transmission line 10, and an inductor element 8 serially connected between the transmission line 4 and a transmission line 11 are magnetically coupled to each other, ESD protection diodes 12 and 13 of which cathodes are connected to the transmission lines 10 and 11, respectively, and anodes thereof are connected to grounds, respectively, and resistors 14 and 15 of which one side terminals are connected to the transmission lines 10 and 11, respectively, and the other side terminals thereof are connected to transmission lines 16 and 17, respectively. Resistance values of the resistors 14 and 15 are set to 10 to 15 ohms, respectively, electrostatic capacitance values of the ESD protection elements 5 and 6 are less than 0.3 pF, respectively, and a clip voltage of each of the ESD protection diodes 12 and 13 is set to a value less than 10 V.

摘要翻译： 公开了一种差分传输电路，其能够在不降低传输信号的情况下实现高静电击穿电阻。 差分传输电路包括分别连接在传输线3和4之间的ESD保护元件5和6和接地，共模滤波器9，其中串联连接在传输线3和传输线10之间的电感器元件7和 串联连接在传输线路4和传输线路11之间的电感器元件8彼此磁耦合，分别连接到传输线路10和11的阴极和其阳极的ESD保护二极管12和13连接到接地 ，电阻器14和15分别连接到传输线路10和11，其中一个侧面端子分别连接到传输线路10和11，并且其另一个侧面端子分别连接到传输线路16和17。 电阻器14和15的电阻值分别设置为10至15欧姆，ESD保护元件5和6的静电电容值分别小于0.3pF，并且每个ESD保护二极管12和 13设定为小于10V的值。

公开(公告)号：US20080113686A1

公开(公告)日：2008-05-15

申请号：US11935425

申请日：2007-11-06

申请人： Masaaki Noda ,  Masaharu Iwasa ,  Akihiko Namba

发明人： Masaaki Noda ,  Masaharu Iwasa ,  Akihiko Namba

IPC分类号： H04M1/00

CPC分类号： H04B1/3805 ,  H03G3/3052

摘要： A high-frequency amplifier inserted between a television input terminal and a first filter and having a current control input for controlling a current value is provided, together with a current control unit for controlling the current of the high-frequency amplifier, and the current of the high-frequency amplifier is set larger while the portable telephone is sending a transmission signal.

摘要翻译： 与用于控制高频放大器的电流的电流控制单元一起，设置插入在电视输入端子和第一滤波器之间并具有用于控制电流值的电流控制输入的高频放大器，以及电流控制单元 当便携式电话发送发送信号时，高频放大器被设置得更大。

公开(公告)号：US07132608B2

公开(公告)日：2006-11-07

申请号：US11052817

申请日：2005-02-09

申请人： Shinichi Endoh ,  Masaharu Iwasa ,  Hideyuki Ito

发明人： Shinichi Endoh ,  Masaharu Iwasa ,  Hideyuki Ito

IPC分类号： H05K1/03

CPC分类号： H05K1/117 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/207 ,  H05K3/28 ,  H05K3/403 ,  H05K2201/035 ,  H05K2201/09736 ,  H05K2203/0113

摘要： A film having a recess provided in a surface of the film is provided. The recess included a first portion and a second portion connected with the first portion. The second portion is deeper than the first portion. The recess in the film is filled with a conductive paste so as to fill the first portion and the second portion of the recess with a first portion and a second portion of the conductive paste, respectively. Then, the surface of the film is attached onto a surface of a substrate. The conductive paste is transferred to the surface of the substrate by removing the film from the substrate so as to transfer the first portion and the second portion of the conductive paste to the surface of the substrate. The transferred first portion and the transferred second portion of the conductive paste are baked to provide a first portion and the second portion of a conductor pattern, respectively. An insulating layer is provided on the conductor pattern. Then, the substrate, the insulating layer, and the conductor pattern are cut along a first border extending across the second portion of the conductor pattern, thus providing an electronic device. In this method, the side electrode is formed simultaneously to the cutting of the substrate.

摘要翻译： 提供了具有设置在膜的表面中的凹部的膜。 凹部包括与第一部分连接的第一部分和第二部分。 第二部分比第一部分更深。 膜中的凹部填充有导电膏，以分别用导电膏的第一部分和第二部分填充凹部的第一部分和第二部分。 然后，将膜的表面附着在基板的表面上。 通过从基板去除膜将导电浆料转移到基板的表面，以将导电浆料的第一部分和第二部分转移到基板的表面。 导电浆料的转移的第一部分和转移的第二部分被烘烤以分别提供导体图案的第一部分和第二部分。 绝缘层设置在导体图案上。 然后，沿着延伸穿过导体图案的第二部分的第一边界切割基板，绝缘层和导体图案，从而提供电子设备。 在该方法中，侧面电极与基板的切割同时形成。