Thermal head and method of manufacturing the same
    1.
    发明授权
    Thermal head and method of manufacturing the same 失效
    热敏头及其制造方法

    公开(公告)号:US5917531A

    公开(公告)日:1999-06-29

    申请号:US930291

    申请日:1997-10-01

    IPC分类号: B41J2/335 B41J2/345

    摘要: A thermal head of the present invention includes an insulating substrate (1), a bulging glaze layer (2) of amorphous glass formed on a surface of the insulating substrate (1), a heating resistor layer (5) formed on the bulging glaze layer (2), an electrode-carrying glaze layer (3) formed on the surface of the insulating substrate (1) to partially overlap the bulging glaze layer (2), and an electrode layer (4) formed on the electrode-carrying glaze layer (3) to partially overlap the heating resistor layer (5). Each of the bulging glaze layer (2) and the electrode-carrying glaze layer (3) is made of amorphous glass. The electrode-carrying glaze layer (3) has a smaller thickness than the bulging glaze layer (2). Thus, it is possible to bake the electrode-carrying glaze layer (3) at a lower temperature than the baking temperature for the bulging glaze layer (2).

    摘要翻译: PCT No.PCT / JP97 / 00392 Sec。 371日期:1997年10月1日 102(e)日期1997年10月1日PCT提交1997年2月13日PCT公布。 公开号WO97 / 29915 PCT 日期:1997年8月21日本发明的热敏头包括绝缘基板(1),形成在绝缘基板(1)的表面上的非晶玻璃的凸出釉层(2),形成有加热电阻层(5) 在凸起釉层(2)上,形成在绝缘基板(1)的表面上以部分地与凸出釉层(2)重叠的电极载持釉层(3)和形成在该釉层 电极承载釉层(3)与发热电阻层(5)部分重叠。 凸出釉层(2)和电极釉层(3)中的每一个由非晶玻璃制成。 电极载持釉层(3)的厚度比凸出釉层(2)的厚度小。 因此,可以在比起凸起釉层(2)的烘烤温度低的温度下烘烤电极载持釉层(3)。