公开(公告)号：US06356445B1

公开(公告)日：2002-03-12

申请号：US09678359

申请日：2000-10-02

申请人： Masataka Mochzuki ,  Chi-Tsung Peng ,  Yung-Chou Chen

发明人： Masataka Mochzuki ,  Chi-Tsung Peng ,  Yung-Chou Chen

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L23/367 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device includes a heat sink (50) for removing heat from an electronic device (90), and a plurality of adjusters (45) for adjusting distance and contact force between the electronic device and the heat sink. The heat sink defines a plurality of receiving holes (62) for receiving respective adjusters, and a plurality of communicating through holes (66) whose diameters are smaller than those of the receiving holes. A shoulder (64) of the heat sink is formed where each receiving hole communicates with each through hole. Each adjuster comprises a connecting shaft (42), a lock screw (46) with a head (464), and a spring (44). The lock screw threadedly engages with the connecting shaft, and the spring is secured between the shoulder of the heat sink and the head.

摘要翻译： 散热装置包括用于从电子设备（90）去除热量的散热器（50），以及用于调节电子设备和散热器之间的距离和接触力的多个调节器（45）。 散热器限定了用于接收相应调节器的多个接收孔（62），以及多个直径小于接收孔的连通通孔（66）。 形成散热器的肩部（64），其中每个容纳孔与每个通孔连通。 每个调节器包括连接轴（42），具有头部（464）的锁定螺钉（46）和弹簧（44）。 锁紧螺丝与连接轴螺纹接合，弹簧固定在散热器的肩部与头部之间。