-
公开(公告)号:US10930515B2
公开(公告)日:2021-02-23
申请号:US16084992
申请日:2017-03-14
IPC分类号: H01L21/3065 , H01L29/66 , H01L29/775 , H01L29/06 , H01L21/306 , H01L21/308 , B82Y10/00 , B81C1/00 , H01L29/78 , B82Y40/00
摘要: The present invention relates to a method for selective etching of a nanostructure (10). The method comprising: providing the nanostructure (10) having a main surface (12) delimited by, in relation to the main surface (12), inclined surfaces (14); and subjecting the nanostructure (10) for a dry etching, wherein the dry etching comprises: subjecting the nanostructure (10) for a low energy particle beam (20) having a direction perpendicular to the main surface (12); whereby a recess (16) in the nanostructure (10) is formed, the recess (16) having its opening at the main surface (12) of the nanostructure (10).
-
公开(公告)号:US20190080918A1
公开(公告)日:2019-03-14
申请号:US16084992
申请日:2017-03-14
IPC分类号: H01L21/3065 , H01L29/06 , H01L29/66 , H01L29/775 , H01L29/78
摘要: The present invention relates to a method for selective etching of a nanostructure (10). The method comprising: providing the nanostructure (10) having a main surface (12) delimited by, in relation to the main surface (12), inclined surfaces (14); and subjecting the nanostructure (10) for a dry etching, wherein the dry etching comprises: subjecting the nanostructure (10) for a low energy particle beam (20) having a direction perpendicular to the main surface (12); whereby a recess (16) in the nanostructure (10) is formed, the recess (16) having its opening at the main surface (12) of the nanostructure (10).
-