Method and apparatus for automatic titration of solder flux
    1.
    发明授权
    Method and apparatus for automatic titration of solder flux 失效
    焊剂自动滴定的方法和装置

    公开(公告)号:US5639954A

    公开(公告)日:1997-06-17

    申请号:US558123

    申请日:1995-11-13

    IPC分类号: B23K1/20 B23K3/00

    CPC分类号: B23K1/203

    摘要: An automatic titration system that periodically and automatically determines the pH level and acid number of a flux solution in a flux reservoir associated with an automatic flux application apparatus. The automatic titration system pulls the flux solution from the flux reservoir of the fluxing machine on a continuous basis to be filtered. Flux to be sampled by the automatic titration system is deposited in a titration chamber where a titration analysis is performed. A known reagent solution is mixed with the flux solution in the titration chamber to determine the pH level and acid number of the sampled flux during the titration operation. Containers of flux solution and thinner solution located in the automatic titration system allow flux and thinner to be dispensed into the flux reservoir depending on the outcome of the titration analysis, so as to maintain the flux in the flux reservoir at the desirable pH level and acid number.

    摘要翻译: 一种自动滴定系统,其定期并自动地确定与自动助焊剂施加装置相关联的通量储存器中的助熔剂溶液的pH值和酸值。 自动滴定系统连续吸取助熔剂助焊剂溶液,以进行过滤。 通过自动滴定系统取样的助焊剂沉积在进行滴定分析的滴定室中。 将已知的试剂溶液与滴定室中的助熔剂溶液混合以确定滴定操作期间取样的通量的pH值和酸值。 根据滴定分析的结果,位于自动滴定系统中的助熔剂溶液和稀释溶液的容器允许通量和稀释剂分配到通量储存器中,以便将通量储存器中的通量保持在期望的pH水平和酸 数。