公开(公告)号：US20070212873A1

公开(公告)日：2007-09-13

申请号：US11748569

申请日：2007-05-15

申请人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

发明人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

IPC分类号： H01L21/4763

CPC分类号： H01L21/0271 ,  H01L23/585 ,  H01L2924/0002 ,  Y10S438/942 ,  Y10S438/947 ,  Y10S438/95 ,  H01L2924/00

摘要： A semiconductor manufacturing method comprises forming a leveling guard ring defining an interior area into which are fabricated one or more devices. In certain embodiments two or more matched devices, such as in a common centroid layout, are fabricated in the interior area. The guard ring is formed on at least one particular layer for a particular processing step. By the guard ring overwhelming the effect of local features' elevation differences, photoresist thereafter applied consequently has a more uniform height across the interior area, resulting in more uniform devices. In some embodiments, a plurality of guard rings enclosing respective arrays of matched devices are arranged over the surface of a semiconductor wafer, spaced apart so as to be not local to one another. Based on the equalizing effect by each of the guard rings, the respective devices arranged in the interior areas are more evenly matched to equivalent devices in far-spaced guard rings. Thus, both local and global matching are achieved.

摘要翻译： 半导体制造方法包括形成限定内部区域的调平保护环，其中制造了一个或多个装置。 在某些实施例中，在内部区域中制造两个或多个匹配的装置，例如以共同的质心布局。 保护环形成在用于特定加工步骤的至少一个特定层上。 由于保护环压倒了局部特征的高程差异的影响，因此其后应用的光致抗蚀剂在内部区域具有更均匀的高度，导致更均匀的装置。 在一些实施例中，包围匹配装置的相应阵列的多个保护环布置在半导体晶片的表面上，间隔开，以便彼此不是局部的。 基于每个保护环的均衡效应，布置在内部区域中的各个装置与远距离保护环中的等效装置更均匀地匹配。 因此，实现了本地和全局匹配。

公开(公告)号：US20060057840A1

公开(公告)日：2006-03-16

申请号：US10941665

申请日：2004-09-14

申请人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

发明人： Daniel Kerr ,  Roscoe Luce ,  Michele Jamison ,  Alan Chen ,  William Russell

IPC分类号： H01L21/4763

CPC分类号： H01L21/0271 ,  H01L23/585 ,  H01L2924/0002 ,  Y10S438/942 ,  Y10S438/947 ,  Y10S438/95 ,  H01L2924/00

摘要： A semiconductor manufacturing method comprises forming a leveling guard ring defining an interior area into which are fabricated one or more devices. In certain embodiments two or more matched devices, such as in a common centroid layout, are fabricated in the interior area. The guard ring is formed on at least one particular layer for a particular processing step. By the guard ring overwhelming the effect of local features' elevation differences, photoresist thereafter applied consequently has a more uniform height across the interior area, resulting in more uniform devices. In some embodiments, a plurality of guard rings enclosing respective arrays of matched devices are arranged over the surface of a semiconductor wafer, spaced apart so as to be not local to one another. Based on the equalizing effect by each of the guard rings, the respective devices arranged in the interior areas are more evenly matched to equivalent devices in far-spaced guard rings. Thus, both local and global matching are achieved.

摘要翻译： 半导体制造方法包括形成限定内部区域的调平保护环，其中制造了一个或多个装置。 在某些实施例中，在内部区域中制造两个或多个匹配的装置，例如以共同的质心布局。 保护环形成在用于特定加工步骤的至少一个特定层上。 由于保护环压倒了局部特征的高程差异的影响，因此其后应用的光致抗蚀剂在内部区域具有更均匀的高度，导致更均匀的装置。 在一些实施例中，包围匹配装置的相应阵列的多个保护环布置在半导体晶片的表面上，间隔开，以便彼此不是局部的。 基于每个保护环的均衡效应，布置在内部区域中的各个装置与远距离保护环中的等效装置更均匀地匹配。 因此，实现了本地和全局匹配。