公开(公告)号：US08360666B2

公开(公告)日：2013-01-29

申请号：US12981542

申请日：2010-12-30

申请人： Ming-Yuan Lin

发明人： Ming-Yuan Lin

IPC分类号： G03B17/00

CPC分类号： H04N5/2257 ,  H04N17/002 ,  Y10T29/49002

摘要： A camera module includes a lens assembly and a baseboard assembly mounted on the lens assembly. The lens assembly includes a lens, a barrel receiving the lens, and a support receiving the barrel. The baseboard assembly includes a circuit board and an image sensor on the circuit board. The support defines a clamping recess at an outer surface thereof.

摘要翻译： 相机模块包括透镜组件和安装在透镜组件上的基板组件。 透镜组件包括透镜，容纳透镜的镜筒和容纳镜筒的支架。 基板组件包括电路板和电路板上的图像传感器。 支撑件在其外表面处限定夹紧凹部。

公开(公告)号：US20110311214A1

公开(公告)日：2011-12-22

申请号：US12981583

申请日：2010-12-30

申请人： MING-YUAN LIN ,  JEN-TSORNG CHANG

发明人： MING-YUAN LIN ,  JEN-TSORNG CHANG

IPC分类号： G03B17/02 ,  B23P11/00

CPC分类号： H04N17/002 ,  H04N5/2257 ,  Y10T29/49826

摘要： A camera module includes a lens assembly and a baseboard assembly mounted on the lens assembly. The lens assembly includes a lens, a barrel receiving the lens, and a support member receiving the barrel. The baseboard assembly includes a circuit board and an image sensor on the circuit board. The baseboard defines a friction surface at a side surface thereof.

摘要翻译： 相机模块包括透镜组件和安装在透镜组件上的基板组件。 透镜组件包括透镜，容纳透镜的镜筒和容纳镜筒的支撑件。 基板组件包括电路板和电路板上的图像传感器。 基板在其侧面限定摩擦表面。

公开(公告)号：US08275254B2

公开(公告)日：2012-09-25

申请号：US12981583

申请日：2010-12-30

申请人： Ming-Yuan Lin ,  Jen-Tsorng Chang

发明人： Ming-Yuan Lin ,  Jen-Tsorng Chang

IPC分类号： G03B17/02

CPC分类号： H04N17/002 ,  H04N5/2257 ,  Y10T29/49826

摘要： A camera module includes a lens assembly and a baseboard assembly mounted on the lens assembly. The lens assembly includes a lens, a barrel receiving the lens, and a support member receiving the barrel. The baseboard assembly includes a circuit board and an image sensor on the circuit board. The baseboard defines a friction surface at a side surface thereof.

摘要翻译： 相机模块包括透镜组件和安装在透镜组件上的基板组件。 透镜组件包括透镜，容纳透镜的镜筒和容纳镜筒的支撑件。 基板组件包括电路板和电路板上的图像传感器。 基板在其侧面限定摩擦表面。

公开(公告)号：US20100201863A1

公开(公告)日：2010-08-12

申请号：US12762331

申请日：2010-04-17

申请人： MING-YUAN LIN

发明人： MING-YUAN LIN

IPC分类号： H04N5/225

CPC分类号： G02B7/02 ,  H05K1/183

摘要： A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.

摘要翻译： 相机模块包括透镜架，透镜模块，图像传感器芯片和印刷电路板。 透镜模块被容纳在透镜架中。 透镜模块包括透镜镜筒和容纳在透镜镜筒中的至少一个透镜。 图像传感器芯片具有被配置为用于接收透射透镜模块的光的感光区域。 印刷电路板限定了用于接收图像传感器芯片和镜筒的顶表面和其上的相对的底表面。 底面在其上限定多个凹槽，用于通过粘合剂在其中接收相应的电子元件。

公开(公告)号：US20090033790A1

公开(公告)日：2009-02-05

申请号：US11935367

申请日：2007-11-05

申请人： MING-YUAN LIN

发明人： MING-YUAN LIN

IPC分类号： H04N5/225 ,  G03B17/00

CPC分类号： H04N5/2253 ,  G02B7/023 ,  G02B13/001 ,  H04N5/2254 ,  H04N5/2257

摘要： A camera module includes a lens holder, a lens module, an image sensor chip, and a PCB defining a step-shaped recess on the upper thereof. The step-shaped recess comprises a first recess formed on an upper portion thereof and a second recess, for receiving a plurality of electrical elements therein, coaxially formed on a lower portion thereof, and a intermediate step surface formed between the first recess and the second recess. A cover plate received in the first recess and attached on the intermediate step surface defines at least one electronic layer therein and an external point formed on the bottom thereof. At least one zero voltage point is formed on the intermediate step surface thereof. The electronic layer is electrically connected to the zero voltage points by the external points, thereby electromagnetic waves generated by the electronic elements are prevented from affecting the image sensor chip.

摘要翻译： 相机模块包括透镜保持器，透镜模块，图像传感器芯片和在其上部限定阶梯形凹部的PCB。 该阶梯形凹部包括形成在其上部的第一凹部和用于在其下部同轴地形成有多个电气元件的第二凹部，以及形成在第一凹部和第二凹部之间的中间台阶面 休息。 容纳在第一凹部中并附着在中间台阶表面上的盖板在其中限定至少一个电子层和形成在其底部的外部点。 在其中间台阶表面上形成至少一个零电压点。 电子层通过外部点电连接到零电压点，从而防止由电子元件产生的电磁波影响图像传感器芯片。

公开(公告)号：US20080095529A1

公开(公告)日：2008-04-24

申请号：US11617070

申请日：2006-12-28

申请人： PO-CHIH HSU ,  MING-YUAN LIN

发明人： PO-CHIH HSU ,  MING-YUAN LIN

IPC分类号： G03B17/00

CPC分类号： G03B17/28 ,  H04N5/2251 ,  H04N5/2257

摘要： A digital camera module package (200) includes a base (20), an image sensor chip package (21) and a lens module (22). The image sensor chip package is mounted on the base. The lens module includes a cavity (257). The cavity fittingly receives the image sensor chip package, and presses against a circumferential wall of the image sensor chip package. The digital cameral module package may precisely align the image sensor chip package with the lens module.

摘要翻译： 数码相机模块封装（200）包括基座（20），图像传感器芯片封装（21）和透镜模块（22）。 图像传感器芯片封装安装在基座上。 透镜模块包括空腔（257）。 空腔适合接收图像传感器芯片封装，并且压靠图像传感器芯片封装的圆周壁。 数码相机模块包可以将图像传感器芯片封装与透镜模块精确对准。

公开(公告)号：US20120268644A9

公开(公告)日：2012-10-25

申请号：US12762331

申请日：2010-04-17

申请人： MING-YUAN LIN

发明人： MING-YUAN LIN

IPC分类号： H04N5/225

CPC分类号： G02B7/02 ,  H05K1/183

摘要： A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.

摘要翻译： 相机模块包括透镜架，透镜模块，图像传感器芯片和印刷电路板。 透镜模块被容纳在透镜架中。 透镜模块包括透镜镜筒和容纳在透镜镜筒中的至少一个透镜。 图像传感器芯片具有被配置为用于接收透射透镜模块的光的感光区域。 印刷电路板限定了用于接收图像传感器芯片和镜筒的顶表面和其上的相对的底表面。 底面在其上限定多个凹槽，用于通过粘合剂在其中接收相应的电子元件。

公开(公告)号：US20110311213A1

公开(公告)日：2011-12-22

申请号：US12981542

申请日：2010-12-30

申请人： MING-YUAN LIN

发明人： MING-YUAN LIN

IPC分类号： G03B17/00 ,  H05K13/00

CPC分类号： H04N5/2257 ,  H04N17/002 ,  Y10T29/49002

摘要： A camera module includes a lens assembly and a baseboard assembly mounted on the lens assembly. The lens assembly includes a lens, a barrel receiving the lens, and a support receiving the barrel. The baseboard assembly includes a circuit board and an image sensor on the circuit board. The support defines a clamping recess at an outer surface thereof.

摘要翻译： 相机模块包括透镜组件和安装在透镜组件上的基板组件。 透镜组件包括透镜，容纳透镜的镜筒和容纳镜筒的支架。 基板组件包括电路板和电路板上的图像传感器。 支撑件在其外表面处限定夹紧凹部。

公开(公告)号：US07782391B2

公开(公告)日：2010-08-24

申请号：US11935367

申请日：2007-11-05

申请人： Ming-Yuan Lin

发明人： Ming-Yuan Lin

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  G02B7/023 ,  G02B13/001 ,  H04N5/2254 ,  H04N5/2257

摘要： A camera module includes a lens holder, a lens module, an image sensor chip, and a PCB defining a step-shaped recess on the upper thereof. The step-shaped recess comprises a first recess formed on an upper portion thereof and a second recess, for receiving a plurality of electrical elements therein, coaxially formed on a lower portion thereof, and a intermediate step surface formed between the first recess and the second recess. A cover plate received in the first recess and attached on the intermediate step surface defines at least one electronic layer therein and an external point formed on the bottom thereof. At least one zero voltage point is formed on the intermediate step surface thereof. The electronic layer is electrically connected to the zero voltage points by the external points, thereby electromagnetic waves generated by the electronic elements are prevented from affecting the image sensor chip.

摘要翻译： 相机模块包括透镜保持器，透镜模块，图像传感器芯片和在其上部限定阶梯形凹部的PCB。 该阶梯形凹部包括形成在其上部的第一凹部和用于在其下部同轴地形成有多个电气元件的第二凹部，以及形成在第一凹部和第二凹部之间的中间台阶面 休息。 容纳在第一凹部中并附着在中间台阶表面上的盖板在其中限定至少一个电子层和形成在其底部的外部点。 在其中间台阶表面上形成至少一个零电压点。 电子层通过外部点电连接到零电压点，从而防止由电子元件产生的电磁波影响图像传感器芯片。

公开(公告)号：US20090033789A1

公开(公告)日：2009-02-05

申请号：US11935366

申请日：2007-11-05

申请人： MING-YUAN LIN

发明人： MING-YUAN LIN

IPC分类号： H04N5/225 ,  G03B17/00

CPC分类号： G02B7/02 ,  H05K1/183

摘要： A camera module includes a lens holder, a lens module, an image sensor chip, and a printed circuit board. The lens module is received in the lens holder. The lens module includes a lens barrel and at least one lens received in the lens barrel. The image sensor chip has a photosensitive area configured for receiving light transmitted through the lens module. The printed circuit board defines a top surface for receiving both the image sensor chip and the lens barrel thereon and an opposite bottom surface thereon. The bottom surface defines a plurality of recesses thereon for receiving the corresponding electronic elements therein by adhesives.

摘要翻译： 相机模块包括透镜架，透镜模块，图像传感器芯片和印刷电路板。 透镜模块被容纳在透镜架中。 透镜模块包括透镜镜筒和容纳在透镜镜筒中的至少一个透镜。 图像传感器芯片具有被配置为用于接收透射透镜模块的光的感光区域。 印刷电路板限定了用于接收图像传感器芯片和镜筒的顶表面和其上的相对的底表面。 底面在其上限定多个凹槽，用于通过粘合剂在其中接收相应的电子元件。