公开(公告)号：US06593170B2

公开(公告)日：2003-07-15

申请号：US09846294

申请日：2001-05-02

申请人： Satoshi Tateiwa ,  Mirei Toida

发明人： Satoshi Tateiwa ,  Mirei Toida

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  B28D5/022 ,  H01L21/78 ,  H01L2221/68327

摘要： A method of dividing a semiconductor wafer of which the surface has a plurality of chips sectioned by streets, into individual chips, characterized in that it comprises a scribing step in which division guide lines are formed by drawing scribed lines along the streets on the surface of the semiconductor wafer, a tape sticking step in which a tape is stuck onto the surface having the division guide lines formed thereon, of the semiconductor wafer, and a back surface cutting step in which cutting grooves are formed in the back surface, to which the tape is stuck, of the semiconductor wafer such that a bit of uncut portions are left along the division guide lines.

摘要翻译： 将表面具有由街道划分的多个芯片的半导体晶片分割为单个芯片的方法，其特征在于，其包括划线步骤，其中通过沿着街道上的街道绘制划线来形成划分引导线 半导体晶片，将带粘贴到其上形成有分割导向线的表面上的胶带粘贴步骤，以及背面切割步骤，其中在后表面中形成有切割槽， 胶带被卡住，使得一部分未切割部分沿着分割引导线留下。