公开(公告)号：US20190214299A1

公开(公告)日：2019-07-11

申请号：US15863954

申请日：2018-01-07

申请人： Infineon Technologies AG

发明人： Christoph Kamseder ,  Franco Mariani ,  Andreas Bauer ,  Thomas Fischer

IPC分类号： H01L21/78 ,  H01L21/67

CPC分类号： H01L21/3043 ,  B28D5/022 ,  H01L21/67092 ,  H01L21/78 ,  H01L22/34

摘要： A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

公开(公告)号：US20170372908A1

公开(公告)日：2017-12-28

申请号：US15621165

申请日：2017-06-13

申请人： DISCO CORPORATION

发明人： Koichi Shigematsu

IPC分类号： H01L21/304 ,  H01L21/683 ,  H01L21/822 ,  H01L21/268

CPC分类号： H01L21/3043 ,  B28D5/022 ,  H01L21/2683 ,  H01L21/67092 ,  H01L21/67288 ,  H01L21/6836 ,  H01L21/78 ,  H01L21/822 ,  H01L22/12 ,  H01L22/26 ,  H01L2221/68327 ,  H01L2933/0033

摘要： There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. In the cutting step, cutting is carried out with detection of whether or not a crack in the processing-target object exists by a crack detecting unit disposed on the rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses.

公开(公告)号：US09779994B2

公开(公告)日：2017-10-03

申请号：US15388062

申请日：2016-12-22

申请人： DISCO CORPORATION

发明人： Hironari Ohkubo ,  Taku Iwamoto

IPC分类号： H01L21/78 ,  H01L21/304 ,  H01L21/66 ,  H01L23/544

CPC分类号： H01L21/78 ,  B28D5/0058 ,  B28D5/022 ,  H01L21/3043 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453

摘要： A wafer processing method including the steps of storing information on the intervals and positions of metal patterns formed on part of division lines on a wafer into a storage unit of a cutting apparatus, detecting the division lines, forming a cut groove along each division line by using a cutting blade, imaging an area including the cut groove at any position where the metal patterns are not formed, by using an imaging unit included in the cutting apparatus, according to the information on the intervals and positions of the metal patterns previously stored, during the step of forming the cut grooves, and measuring the positional relation between the position of the cut groove and a preset cutting position. Accordingly, kerf check can be performed without being influenced by burrs produced from the metal patterns in cutting the wafer, so that the wafer can be cut with high accuracy.

公开(公告)号：US20170133249A1

公开(公告)日：2017-05-11

申请号：US15335988

申请日：2016-10-27

申请人： Samsung Electronics Co., Ltd.

发明人： YOUNGMIN KIM ,  JaeYong PARK ,  KUNHO SONG ,  Byung-Joo JO

IPC分类号： H01L21/67 ,  B32B38/00 ,  B28D5/02 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  B32B37/12 ,  H01L21/687

CPC分类号： H01L21/67132 ,  B28D5/0082 ,  B28D5/022 ,  B32B37/1009 ,  B32B38/0004 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L24/742 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1062 ,  Y10T156/1322

摘要： A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder disposed on the housing and positioned to support a tape film, and an air removal unit connected to a portion of the housing below the film holder to remove and/or exhaust air from the housing resulting to attach the tape film to the substrate.

公开(公告)号：US20170084879A1

公开(公告)日：2017-03-23

申请号：US15159153

申请日：2016-05-19

申请人： EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED

发明人： Chih-wei WEN ,  Denghui LIU

IPC分类号： H01L51/56 ,  B24B55/02 ,  B28D7/02 ,  B24B9/06 ,  B28D5/02

CPC分类号： H01L51/56 ,  B24B9/065 ,  B24B55/02 ,  B28D5/022 ,  B28D7/02 ,  H01L51/5246 ,  H01L2251/566

摘要： A method for cutting a display panel is provided by the disclosure. The display panel includes a substrate, a cover plate provided opposite to the substrate, multiple display components sandwiched between the substrate and the cover plate, and encapsulation glue sandwiched between the substrate and the cover plate and surrounding the multiple display components. The method includes: forming multiple display modules by cutting the substrate and the cover plate of the display panel at a position between adjacent display components; and edging a display module obtained through the cutting with an edging machine by a distance from an edge of the display module to inward of the encapsulation glue, until the encapsulation glue is grinded to a preset width. A design of slim bezel can be achieved for the display panel with high accuracy by the method for cutting the display panel according to the disclosure.

公开(公告)号：US20160346956A1

公开(公告)日：2016-12-01

申请号：US15163892

申请日：2016-05-25

申请人： DISCO CORPORATION

发明人： Masahiro Takekawa ,  Tatsuhiko Mori ,  Hirotaka Ochiai ,  Frank Wei

IPC分类号： B28D7/00 ,  B23Q17/09 ,  B23Q17/24 ,  B28D5/02

CPC分类号： B28D7/005 ,  B23Q17/0961 ,  B23Q17/0971 ,  B23Q17/10 ,  B23Q17/20 ,  B23Q17/2409 ,  B28D5/022

摘要： There is provided a processing system including a processing apparatus having functional units including a holding unit that holds a workpiece by a holding surface, a processing unit that processes the workpiece held by the holding unit, and a feed unit that moves the holding unit and the processing unit relatively. The processing system further includes a detecting unit that is provided for part or all of the functional units and detects any of vibration, current, voltage, load, speed, torque, pressure, temperature, flow rate, change in a taken image, and the thickness of the workpiece, and a data accumulating unit that accumulates information included in a signal output from the detecting unit as data.

摘要翻译： 提供了一种处理系统，包括具有功能单元的处理装置，所述功能单元包括通过保持表面保持工件的保持单元，处理由保持单元保持的工件的处理单元和使保持单元和 相对处理单位 该处理系统还包括检测单元，其被设置用于部分或全部功能单元，并且检测振动，电流，电压，负载，速度，转矩，压力，温度，流量，拍摄图像中的任何变化， 工件的厚度以及将从检测部输出的信号中包含的信息作为数据进行累积的数据累积部。

公开(公告)号：US20160343614A1

公开(公告)日：2016-11-24

申请号：US15151143

申请日：2016-05-10

申请人： DISCO CORPORATION

发明人： Yuki Ogawa ,  Kensuke Nagaoka ,  Tsubasa Obata ,  Yuri Ban

IPC分类号： H01L21/78 ,  H01L21/304 ,  H01L21/683 ,  H01L23/544

CPC分类号： H01L21/78 ,  B23K26/364 ,  B23K2103/56 ,  B28D5/00 ,  B28D5/022 ,  H01L21/3043 ,  H01L21/6836 ,  H01L22/12 ,  H01L22/20 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A wafer having a substrate and a functional layer formed on the front side of the substrate is processed by attaching a protective tape curable by an external stimulation to the front side of the functional layer. The substrate is cut from the back side along each division line by using a cutting blade, thereby forming a cut groove having a depth not reaching the functional layer, with a part of the substrate left between the bottom of the cut groove and the functional layer. A laser beam is applied along the cut groove, thereby dividing the remaining part of the substrate to divide the wafer into device chips. When the groove is formed, an uncut portion in which the cut groove is not formed is left in a peripheral marginal area of the wafer.

摘要翻译： 通过将通过外部刺激固化的保护带附着在功能层的前侧来处理具有形成在基板的正面上的基板和功能层的晶片。 通过使用切割刀沿着分割线从后侧切割基板，从而形成具有未到达功能层的深度的切割槽，其中一部分基板留在切割槽的底部和功能层之间 。 沿着切割槽施加激光束，从而划分衬底的剩余部分以将晶片分成器件芯片。 当形成凹槽时，其中未形成切割槽的未切割部分留在晶片的周边边缘区域中。

公开(公告)号：US20160067970A1

公开(公告)日：2016-03-10

申请号：US14941898

申请日：2015-11-16

申请人： STMICROELECTRONICS, INC.

发明人： KENNETH J. STEWART

IPC分类号： B41J2/16

CPC分类号： B41J2/1632 ,  B28D5/022 ,  B28D5/027 ,  B41J2/14112 ,  B41J2/14129 ,  B41J2/145 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1635 ,  B41J2002/14491 ,  H01L21/78 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49798

摘要： A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

摘要翻译： 制造喷墨打印头的方法可以包括通过用旋转锯片锯切在晶片的第一表面中形成第一不连续的开槽凹槽。 第一不连续的开槽凹槽可以以平行的，间隔的关系布置。 该方法可以进一步包括通过与旋转锯片锯切形成在晶片的第二表面中的第二不连续开槽的凹槽，其与第一连续开槽的凹槽对准并耦合以限定贯穿晶片通道。 在另一个实施例中，第一和第二多个不连续凹槽可以由相应的第一和第二旋转锯片形成。

公开(公告)号：US09130057B1

公开(公告)日：2015-09-08

申请号：US14320405

申请日：2014-06-30

申请人： Prabhat Kumar ,  Wei-Sheng Lei ,  James Papanu ,  Brad Eaton ,  Ajay Kumar

发明人： Prabhat Kumar ,  Wei-Sheng Lei ,  James Papanu ,  Brad Eaton ,  Ajay Kumar

IPC分类号： H01L21/822 ,  H01L21/67 ,  B23K26/00 ,  B26D9/00

CPC分类号： B26D9/00 ,  B23K26/0624 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  B26D3/06 ,  B28D5/022 ,  H01L21/67092 ,  H01L21/78

摘要： A method and system of hybrid dicing using a blade and laser are described. In one embodiment, a method involves focusing a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. The method also involves forming a groove on a surface of the substrate with a blade saw in the regions. The method further involves singulating the integrated circuits at the regions with the induced defects and the groove. In one embodiment, a system includes a laser module configured to focus a laser beam inside the substrate in regions between the integrated circuits, inducing defects inside the substrate in the regions. A blade grooving module is configured to form a groove in a surface of the substrate with a blade saw in the regions.

摘要翻译： 描述了使用刀片和激光器的混合切割的方法和系统。 在一个实施例中，一种方法包括将集成电路之间的区域内的激光束聚焦在衬底内，从而在区域内的衬底内引起缺陷。 该方法还涉及在该区域中具有刀片锯的基板的表面上形成凹槽。 该方法还涉及在具有感应缺陷和凹槽的区域处分离集成电路。 在一个实施例中，系统包括激光模块，该激光模块被配置为将集成电路之间的区域内的激光束聚焦在衬底内，从而在该区域内的衬底内引起缺陷。 刀片切槽模块被配置为在所述区域中具有刀片锯的基板的表面中形成凹槽。

公开(公告)号：US20150107572A1

公开(公告)日：2015-04-23

申请号：US14397040

申请日：2013-04-24

申请人： Junji Watanabe ,  Tokyo Seimitsu Co., Ltd. ,  Shin-Nihon Tech Inc.

发明人： Takashi Fujita ,  Yasuo Izumi ,  Junji Watanabe

IPC分类号： B28D5/02 ,  B28D1/12 ,  B24D5/12

CPC分类号： B28D5/022 ,  B24B27/06 ,  B24D5/12 ,  B28D1/121

摘要： An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.

摘要翻译： 本发明的目的是提供一种即使在由脆性材料形成的工件中也不会引起断裂和切断的切割刀片，并且能够以高精度在工件上以延展性方式稳定地进行切削加工。 对工件进行切割处理的切割刀片26由金刚石烧结体80一体地形成，该金刚石烧结体80通过烧结金刚石磨粒82以形成盘状，并且金刚石的金刚石磨粒82的含量 烧结体80为80体积％以上。 优选地，形成在金刚石烧结体80的表面上的凹部沿圆周方向连续地设置在切割刀26的外周部。