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公开(公告)号：US06417691B1
公开(公告)日：2002-07-09
申请号：US09650933
申请日：2000-08-29
IPC分类号： H01L2500
CPC分类号： G06F15/7867
摘要： A communication device provides for a hardware configurable module interface port by using a programmable logic device (108). The programmable logic device (108) is reconfigured using software stored in memory (106). The reconfiguration of programmable logic device (108) depends on the type of module (110) that is attached to the communication device. Since data translation is not required to be performed by each of the different types of modules that can be attached to the communication device, the time to develop a module is shortened and support circuitry requirements to perform data translation is reduced.
摘要翻译： 通信设备通过使用可编程逻辑器件（108）提供硬件可配置模块接口端口。 可编程逻辑器件（108）使用存储在存储器（106）中的软件进行重新配置。 可编程逻辑设备（108）的重新配置取决于附接到通信设备的模块（110）的类型。 由于数据转换不需要由可以附着到通信设备的每种不同类型的模块执行，所以缩短了开发模块的时间，并且减少了执行数据转换的支持电路要求。
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公开(公告)号：US20090067138A1
公开(公告)日：2009-03-12
申请号：US11853246
申请日：2007-09-11
IPC分类号： H05K5/00
CPC分类号： H04M1/0237 , G06F1/1624 , G06F1/1683 , H02G11/00
摘要： An electronic device is provided, which includes first housing, a first electronic element incorporated into the first housing, a second housing slidably coupled to the first housing, and a second electronic element incorporated into the second housing. A connective member couples the first electronic element to the second electronic element. The connective member includes a rolling flexible segment contained substantially within the first housing.
摘要翻译： 提供了一种电子设备，其包括第一壳体，并入第一壳体中的第一电子元件，可滑动地联接到第一壳体的第二壳体和结合到第二壳体中的第二电子元件。 连接构件将第一电子元件耦合到第二电子元件。 连接构件包括基本上包含在第一壳体内的滚动柔性段。
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公开(公告)号：US5771154A
公开(公告)日：1998-06-23
申请号：US833018
申请日：1997-04-03
CPC分类号： H04R1/00
摘要： A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.
摘要翻译： 散热器组件（100）为包含在通信产品外壳（130）内的大功率集成电路封装（102）提供额外的散热。 从包装件突出的整体散热器（104）。 散热器与导热构件（106）的第一端（108）摩擦配合。 导电构件的第二端（110）磁耦合到扬声器磁体（122）的后表面（123）。 远离导电构件的第二端延伸的突片111提供附加的机械支撑，防止第二端滑动抵靠磁体的后表面。 由大功率器件产生的热量通过导热部件从封装散热片传递到扬声器磁体，使得热量从封装和磁体中消散。
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公开(公告)号：USD448019S1
公开(公告)日：2001-09-18
申请号：US29122966
申请日：2000-05-08
申请人： Todd M. Cebe , Mitchell E. Goodman
设计人： Todd M. Cebe , Mitchell E. Goodman
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