公开(公告)号：US06416571B1

公开(公告)日：2002-07-09

申请号：US09606269

申请日：2000-06-29

申请人： Mitsuru Kaneko ,  Asao Hatta ,  Mitsuharu Kunii

发明人： Mitsuru Kaneko ,  Asao Hatta ,  Mitsuharu Kunii

IPC分类号： C23C1850

CPC分类号： C25D3/58 ,  C25D3/60

摘要： The present invention provides a pyrophosphoric acid bath for use in Cu—Sn alloy plating without containing a cyanic ion comprising a reaction product (A) of an amine derivative and an epihalohydrin in a 1:1 mole ratio and a cationic surfactant (B) and, when necessary, further comprising a surface tension adjusting agent (C), a bath stabilizer (D) and an N-benzylpyridinium derivative (E) as additives. According to the bath of the present invention, by changing a bath composition of copper and tin or by employing a characteristic additive, a stable film with a silver-white, gold, copper or light black color can be obtained. By increasing tin contents in the bath, the bath can be used for lead-free solder plating. The bath is safe in handling and hygienic and, moreover, has no sewage process and environmental problems since it contains neither cyanic compound nor formaldehyde derivative.

摘要翻译： 本发明提供一种用于Cu-Sn合金电镀的焦磷酸浴，其不含氰离子，其包含胺衍生物和摩尔比为1：1的表卤代醇的反应产物（A）和阳离子表面活性剂（B）和 当需要时，进一步包含作为添加剂的表面张力调节剂（C），浴稳定剂（D）和N-苄基吡啶鎓衍生物（E）。 根据本发明的浴，通过改变铜和锡的浴组成或通过使用特征添加剂，可以获得银 - 白，金，铜或浅黑色的稳定膜。 通过增加浴中的锡含量，可以将浴用于无铅焊料镀层。 浴缸处理和卫生安全，而且没有污水处理和环境问题，因为它既不含氰化合物也不含甲醛衍生物。