公开(公告)号：US20140150558A1

公开(公告)日：2014-06-05

申请号：US13907748

申请日：2013-05-31

申请人： Mohamed Mahmoud Taher EL Gowini ,  Walied Ahmed Mohamed Moussa ,  Edmond Hok Ming Lou

发明人： Mohamed Mahmoud Taher EL Gowini ,  Walied Ahmed Mohamed Moussa ,  Edmond Hok Ming Lou

IPC分类号： G01H11/08

CPC分类号： G01H11/08 ,  G01N29/2475 ,  G01N2291/0251

摘要： An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminium nitride film on top of the substrate and a thin gold film above the aluminium nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.

摘要翻译： 提供了使用声波MEMS传感器来表征粘合剂粘合的装置和方法。 传感器可以由硅衬底，衬底顶部的薄氮化铝膜和氮化铝层上方的薄金膜组成。 在传感器的顶部添加粘合剂层，并且分层结构中的声波的分散特性可用于粘合完整性表征。 开发了波分散模型​​，研究了改变界面刚度对波段色散特性的影响，并研究了不同传感器配置的灵敏度。 该模型的结果表明，当界面刚度降低时，色散轮廓在减小波速的方向上移动。