公开(公告)号：US08221560B2

公开(公告)日：2012-07-17

申请号：US12309382

申请日：2008-09-04

申请人： Kang Hee Kim ,  Yong Cheol Chu ,  Myoung Ho Chun ,  Sang Ho Jeon ,  Hyun Kyu Lee

发明人： Kang Hee Kim ,  Yong Cheol Chu ,  Myoung Ho Chun ,  Sang Ho Jeon ,  Hyun Kyu Lee

IPC分类号： B23K35/22

CPC分类号： B23K35/262 ,  B23K35/40 ,  C22C1/02 ,  C22C13/00 ,  H05K3/3463

摘要： Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.

摘要翻译： 本发明公开了一种无铅焊料合金及其制造方法。 更具体地，公开了：无铅焊料合金，其包含0.8-1.2重量％的银（Ag），0.8-1.2重量％的铜（Cu），0.01-1.0重量％的钯（Pd），0.001-0.1重量％ 碲（Te）和锡（Sn）的平衡，因此具有与现有无铅焊料合金相似的熔点，优异的润湿性，极低的偏析比和与焊接母材具有优异的焊接性，使得 当它应用于电子设备和印刷电路板时，同时提高温度循环性能和降低耐冲击性; 上述合金的制造方法; 以及包括其的电子设备和印刷电路板。

公开(公告)号：US20100272598A1

公开(公告)日：2010-10-28

申请号：US12309382

申请日：2008-09-04

申请人： Kang Hee Kim ,  Yong Cheol Chu ,  Myoung Ho Chun ,  Sang Ho Jeon ,  Hyun Kyu Lee

发明人： Kang Hee Kim ,  Yong Cheol Chu ,  Myoung Ho Chun ,  Sang Ho Jeon ,  Hyun Kyu Lee

IPC分类号： C22C13/00 ,  C22C1/02

CPC分类号： B23K35/262 ,  B23K35/40 ,  C22C1/02 ,  C22C13/00 ,  H05K3/3463

摘要： Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.

摘要翻译： 本发明公开了一种无铅焊料合金及其制造方法。 更具体地，公开了：无铅焊料合金，其包含0.8-1.2重量％的银（Ag），0.8-1.2重量％的铜（Cu），0.01-1.0重量％的钯（Pd），0.001-0.1重量％ 碲（Te）和锡（Sn）的平衡，因此具有与现有的无铅焊料合金相似的熔点，优异的润湿性，极低的偏析比和与焊接母材具有优异的焊接性，使得 当它应用于电子设备和印刷电路板时，同时提高温度循环性能和降低耐冲击性; 上述合金的制造方法; 以及包括其的电子设备和印刷电路板。