DAS housing with enhanced heat transfer capability for CT imaging system
    4.
    发明授权
    DAS housing with enhanced heat transfer capability for CT imaging system 失效
    DAS外壳具有增强的CT成像系统传热能力

    公开(公告)号:US5857007A

    公开(公告)日:1999-01-05

    申请号:US923064

    申请日:1997-09-03

    申请人: Nadeem Haq

    发明人: Nadeem Haq

    IPC分类号: H05G1/02 H05G1/64

    CPC分类号: H05G1/02

    摘要: In a CT imaging system which includes a gantry having a rotatable ring member and a DAS comprising circuit boards grouped in a selected number of sets, a DAS housing is provided which is disposed to dissipate heat away from the DAS circuit boards. The housing includes a frame for mounting each of the circuit boards on the gantry ring so that the boards of a set are in spaced-apart relationship with each other, and further includes a cover for each frame, to form an enclosure for the circuit boards supported thereby. Each cover is provided with a panel member, a section of each panel being provided with a specified pattern of perforations. Each panel is positioned with respect to its set of circuit boards to provide an unobstructed space of selected dimension between its pattern of perforations and its corresponding circuit board set.

    摘要翻译: 在包括具有可旋转环构件的台架和包括以选定数量的组合组合的电路板的DAS的CT成像系统中,设置有DAS壳体,其被布置成从DAS电路板散热。 壳体包括用于将每个电路板安装在机架环上的框架,使得一组的板彼此间隔开,并且还包括用于每个框架的盖,以形成用于电路板的外壳 由此支持。 每个盖设有面板构件,每个面板的一部分具有指定的穿孔图案。 每个面板相对于其组的电路板定位,以在其穿孔图案及其对应的电路板组之间提供一定的尺寸空间。