公开(公告)号：US20110084419A1

公开(公告)日：2011-04-14

申请号：US12995556

申请日：2009-06-02

申请人： Takeshi Uekido ,  Nobu Ilzumi ,  Toshiyuki Nishino ,  Eiji Masui ,  Keiichi Yanagida

发明人： Takeshi Uekido ,  Nobu Ilzumi ,  Toshiyuki Nishino ,  Eiji Masui ,  Keiichi Yanagida

IPC分类号： B29D7/01

CPC分类号： B29C41/003 ,  B29C41/24 ,  B29C55/08 ,  B29D7/01 ,  B29K2077/10 ,  B29K2079/08 ,  B29L2007/008 ,  C08G73/1067 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08

摘要： An aromatic polyimide film having a TD linear expansion coefficient lower than that MD linear expansion coefficient is produced by an industrially advantageous process which is performed under such conditions that a self-supporting aromatic polyimide precursor film having a solvent content of 25-45 wt. % and an imidation ratio of 5-40% is prepared and stretched in the transverse direction under heating initially at 80-240° C. and the stretched self-supporting aromatic polyimide precursor film is subsequently converted to a self-supporting aromatic polyimide film by heating the precursor film at 350-580° C.

摘要翻译： 通过工业上有利的方法制造TD线膨胀系数低于MD线性膨胀系数的芳香族聚酰亚胺膜，该方法是在具有25〜45重量％的溶剂含量的自支撑芳香族聚酰亚胺前体膜的条件下进行的。 ％，酰亚胺化率为5-40％，最初加热至80-240℃，在宽度方向拉伸，拉伸的自支撑芳族聚酰亚胺前体膜随后通过以下方式转化为自支撑芳族聚酰亚胺膜： 在350-580℃下加热前体膜