公开(公告)号：US20100259741A1

公开(公告)日：2010-10-14

申请号：US12756517

申请日：2010-04-08

Applicant: Shinichiro Koga ,  Noburu Takakura

Inventor： Shinichiro Koga ,  Noburu Takakura

IPC: G03B27/54

CPC classification number: G03F9/7011 ,  G03F9/7084

Abstract: An exposure apparatus sequentially transfers a pattern of an original to a plurality of shot regions on a substrate, wherein each shot region includes a chip region and a scribe line region surrounding the chip region. The apparatus comprises a detector configured to detect light beams from a first mark and a second mark arranged in a first scribe line region and a second scribe line region, respectively, adjacent to each other on the substrate driven in a measurement scanning direction by substantially simultaneously observing the first scribe line region and the second scribe line region, and a processor configured to process detection signals output from the detector to determine positions of the first mark and the second mark, wherein the substrate is positioned based on the positions of the first mark and the second mark and is exposed.

Abstract translation: 曝光装置顺序地将原稿的图案转印到基板上的多个拍摄区域，其中每个拍摄区域包括芯片区域和围绕芯片区域的划线区域。 该装置包括：检测器，其被配置为基本上同时地在被测量扫描方向驱动的基板上分别检测布置在第一划线区域和第二划线区域中的第一标记和第二标记的光束 观察第一划线区域和第二划线区域;以及处理器，被配置为处理从检测器输出的检测信号，以确定第一标记和第二标记的位置，其中基于第一标记的位置定位基板 和第二个标记，并暴露。

公开(公告)号：US06333786B1

公开(公告)日：2001-12-25

申请号：US08139059

申请日：1993-10-21

Applicant: Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

Inventor： Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

IPC: G01B1100

CPC classification number: G03F9/7092 ,  G03F9/7003 ,  G03F9/7088

Abstract: An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine of the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.

Abstract translation: 适用于步进重复类型的半导体器件制造曝光设备中的对准方法，用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中，检测提供在晶片的选定区域上的标记以获得对应的标记信号，然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后，基于对应的标记信号的状态或测量的位置数据的状态，并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据，其中，为了准备校正的位置数据，根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置，基于准备的校正位置数据来控制晶片移动，从而确保每个区域的高精度对准。

公开(公告)号：US6097495A

公开(公告)日：2000-08-01

申请号：US102752

申请日：1998-06-23

Applicant: Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

Inventor： Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

IPC: G03F9/00 ,  G01B11/00

CPC classification number: G03F9/7088 ,  G03F9/7003 ,  G03F9/7092

Abstract: An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data. For sequential positioning of the regions on the wafer to the exposure position, the wafer movement is controlled on the basis of the prepared corrected positional data, whereby high-precision alignment of each region is assured.

Abstract translation: 适用于步进重复类型的半导体器件制造曝光设备中的对准方法，用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中，检测提供在晶片的选定区域上的标记以获得对应的标记信号，然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后，基于对应的标记信号的状态或测量的位置数据的状态，并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据，其中，为了准备校正的位置数据，根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。 为了将晶片上的区域顺序定位到曝光位置，基于准备的校正位置数据来控制晶片移动，从而确保每个区域的高精度对准。

公开(公告)号：US08305555B2

公开(公告)日：2012-11-06

申请号：US12756517

申请日：2010-04-08

Applicant: Shinichiro Koga ,  Noburu Takakura

Inventor： Shinichiro Koga ,  Noburu Takakura

IPC: G03B27/42 ,  G03B27/54

CPC classification number: G03F9/7011 ,  G03F9/7084

Abstract: An exposure apparatus sequentially transfers a pattern of an original to a plurality of shot regions on a substrate, wherein each shot region includes a chip region and a scribe line region surrounding the chip region. The apparatus includes a detector configured to detect light beams from a first mark and a second mark arranged in a first scribe line region and a second scribe line region, respectively, adjacent to each other on the substrate driven in a measurement scanning direction by substantially simultaneously observing the first scribe line region and the second scribe line region, and a processor configured to process detection signals output from the detector to determine positions of the first mark and the second mark, wherein the substrate is positioned based on the positions of the first mark and the second mark and is exposed.

Abstract translation: 曝光装置顺序地将原稿的图案转印到基板上的多个拍摄区域，其中每个拍摄区域包括芯片区域和围绕芯片区域的划线区域。 该装置包括：检测器，被配置为基本上同时地在测量扫描方向驱动的基板上分别检测布置在第一划线区域和第二划线区域中的第一标记和第二标记的光束 观察第一划线区域和第二划线区域;以及处理器，被配置为处理从检测器输出的检测信号，以确定第一标记和第二标记的位置，其中基于第一标记的位置定位基板 和第二个标记，并暴露。

公开(公告)号：US5543921A

公开(公告)日：1996-08-06

申请号：US465098

申请日：1995-06-05

Applicant: Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

Inventor： Shigeyuki Uzawa ,  Akiya Nakai ,  Masaaki Imaizumi ,  Hiroshi Tanaka ,  Noburu Takakura ,  Yoshio Kaneko

IPC: G03F9/00 ,  G01B11/00

CPC classification number: G03F9/7088 ,  G03F9/7003 ,  G03F9/7092

Abstract: An aligning method suitably usable in a semiconductor device manufacturing exposure apparatus of step-and-repeat type, for sequentially positioning regions on a wafer to an exposure position. In one preferred form, the marks provided on selected regions of the wafer are detected to obtain corresponding mark signals and then respective positional data related to the positions or positional errors of the selected regions are measured, on the basis of the mark signals. Then, the reliability of each measured positional data of a corresponding selected region is detected, on the basis of the state of a corresponding mark signal or the state of that measured positional data and by using fuzzy reasoning, for example. Corrected positional data related to the disposition of all the regions on the wafer is then prepared by using the measured positional data of the selected regions, wherein, for preparation of the corrected positional data, each measured positional data is weighted in accordance with the detected reliability thereof such that measured positional data having higher reliability is more influential to determine the corrected positional data.

Abstract translation: 适用于步进重复类型的半导体器件制造曝光设备中的对准方法，用于将晶片上的区域顺序地定位到曝光位置。 在一个优选形式中，检测提供在晶片的选定区域上的标记以获得对应的标记信号，然后基于标记信号测量与所选区域的位置或位置误差相关的各个位置数据。 然后，基于对应的标记信号的状态或测量的位置数据的状态，并通过使用模糊推理来检测对应的选择区域的每个测量位置数据的可靠性。 然后通过使用测量的所选择的区域的位置数据来准备与晶片上的所有区域的配置相关的位置数据，其中，为了准备校正的位置数据，根据检测到的可靠性对每个测量的位置数据进行加权 使得具有较高可靠性的测量位置数据对确定校正的位置数据更有影响力。