-
公开(公告)号：US20070058826A1
公开(公告)日：2007-03-15
申请号：US11519977
申请日：2006-09-13
IPC分类号： H04R25/00
CPC分类号： H04R19/04 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A microphone element having a diaphragm and a fixed electrode disposed opposite to each other on a silicon board having a central opening portion is mounted and fixed onto a base board having a sound hole. A perimeter-shaped side board and a cover board are mounted and fixed onto the board, thereby forming a back cavity on an upper side of the microphone element. The diaphragm and the fixed electrode are conducted to conductive layers of the cover board through conductive layers of the base board, and a conductive layer and a coiled spring in the side board respectively, and mounting on a surface of a printed board of an external apparatus can be carried out in a conductive layer on an upper surface thereof.
摘要翻译： 在具有中央开口部的硅板上具有隔膜和固定电极的麦克风元件安装固定在具有声孔的基板上。 周边形侧板和盖板安装并固定在板上，从而在麦克风元件的上侧形成后腔。 隔膜和固定电极分别通过基板的导电层和侧板中的导电层和螺旋弹簧导电到盖板的导电层，并且安装在外部设备的印刷电路板的表面上 可以在其上表面上的导电层中进行。
-
公开(公告)号：US20080130920A1
公开(公告)日：2008-06-05
申请号：US11948446
申请日：2007-11-30
CPC分类号： H04R1/086 , H01G5/014 , H01G5/18 , H04R19/016 , H04R19/04 , H04R31/006 , Y10T29/43
摘要： A capacitor microphone includes: a circuit substrate; a casing substrate fixed to an upper surface of the circuit substrate; a top cover substrate fixed to the upper surface; a capacitor part including a vibration film and a plate contained in the casing substrate; an impedance conversion element for converting variations in the electrostatic capacity of the capacitor part to electrical impedance; an electromagnetic shield portion electromagnetically shielding an inside of the casing substrate, the electromagnetic shield portion being formed in an outer surface of the casing substrate; a non-electromagnetic shield portion having no electromagnetic shield portion, the non-electromagnetic shield portion being formed in an outer surface of the casing substrate; and a through hole having a conductive property, the through hole being formed in the non-electromagnetic shield portion, wherein the inside of the casing substrate is shielded electromagnetically by the electromagnetic shield portion and the through hole.
摘要翻译： 电容麦克风包括：电路基板; 固定到电路基板的上表面的外壳基板; 固定到上表面的顶盖基板; 电容器部，其包括振动膜和容纳在所述壳体基板中的板; 阻抗转换元件，用于将电容器部分的静电电容的变化转换为电阻抗; 所述电磁屏蔽部分电磁屏蔽所述壳体基板的内部，所述电磁屏蔽部分形成在所述壳体基板的外表面中; 不具有电磁屏蔽部的非电磁屏蔽部，所述非电磁屏蔽部形成在所述壳体基板的外表面上; 以及具有导电性的通孔，所述通孔形成在所述非电磁屏蔽部分中，其中所述壳体基板的内部被所述电磁屏蔽部分和所述通孔电磁屏蔽。
-
公开(公告)号：US20080044043A1
公开(公告)日：2008-02-21
申请号：US11842431
申请日：2007-08-21
IPC分类号： H04R25/00
CPC分类号： H04R19/04
摘要： A condenser microphone includes: a base frame including a containing space; a pair of substrates laminated to the base frame to close both end openings of the containing space; a condenser portion that is contained inside of the containing space; conductive layers formed on bonding surfaces of the base frame and the substrates opposed to each other; and exposed surfaces where the surfaces of a base frame main body and a substrate main body are exposed, the exposed surfaces being formed on outer peripheries of the conductive layers, wherein: the conductive layers of the base frame and the substrate are electrically connected; the exposed surfaces of the base frame main body and the substrate main body are adhered by an adhering agent; and an electric connection between the conductive layers is maintained by utilizing an adhering force of the adhering agent.
摘要翻译： 一种电容麦克风包括：一个包括容纳空间的基架; 一对基板层压到基架上以封闭容纳空间的两端开口; 容纳在容纳空间内的冷凝器部; 导电层形成在基框架和彼此相对的基板的接合表面上; 以及暴露的表面，其中基框架主体和基板主体的表面露出，暴露表面形成在导电层的外周上，其中：基架和基板的导电层电连接; 基座主体和基板主体的露出面通过粘合剂粘接; 并且通过利用粘合剂的附着力来保持导电层之间的电连接。
-
公开(公告)号：US20050181659A1
公开(公告)日：2005-08-18
申请号：US11045094
申请日：2005-01-31
CPC分类号： H01R13/2421 , H04R9/063
摘要： The two coil spring terminals have the structure of double coil spring terminal including a small diameter coil spring terminal and a large diameter coil spring terminal. In this case, a terminal holder is provided with a clamping portion for clamping the large diameter coil spring terminal between the terminal holder and an internal circuit board. Specifically, the terminal holder is formed, in an upper end portion of its outer peripheral surface, with an annular groove which is adapted to be engaged with a small diameter portion formed in an upper end portion of the large diameter coil spring terminal. This omits fixation of the large diameter coil spring terminal to the internal circuit board, and necessity of soldering the two coil spring terminals respectively to the internal circuit board as a conventional art, enhancing mounting workability of the terminal holder.
摘要翻译： 两个螺旋弹簧端子具有双螺旋弹簧端子的结构，包括小直径螺旋弹簧端子和大直径螺旋弹簧端子。 在这种情况下，端子保持器设置有用于将大直径螺旋弹簧端子夹持在端子保持器和内部电路板之间的夹紧部。 具体而言，端子座在其外周面的上端部形成有与形成在大径螺旋弹簧端子的上端部的小径部接合的环状槽。 省略了将大直径螺旋弹簧端子固定到内部电路板，并且需要将两个螺旋弹簧端子分别焊接到内部电路板上作为传统技术，从而提高了端子座的安装可操作性。
-
公开(公告)号：US07403631B2
公开(公告)日：2008-07-22
申请号：US11045094
申请日：2005-01-31
IPC分类号： H04R25/00
CPC分类号： H01R13/2421 , H04R9/063
摘要： The two coil spring terminals have the structure of double coil spring terminal including a small diameter coil spring terminal and a large diameter coil spring terminal. In this case, a terminal holder is provided with a clamping portion for clamping the large diameter coil spring terminal between the terminal holder and an internal circuit board. Specifically, the terminal holder is formed, in an upper end portion of its outer peripheral surface, with an annular groove which is adapted to be engaged with a small diameter portion formed in an upper end portion of the large diameter coil spring terminal. This omits fixation of the large diameter coil spring terminal to the internal circuit board, and necessity of soldering the two coil spring terminals respectively to the internal circuit board as a conventional art, enhancing mounting workability of the terminal holder.
摘要翻译： 两个螺旋弹簧端子具有双螺旋弹簧端子的结构，包括小直径螺旋弹簧端子和大直径螺旋弹簧端子。 在这种情况下，端子保持器设置有用于将大直径螺旋弹簧端子夹持在端子保持器和内部电路板之间的夹紧部。 具体而言，端子座在其外周面的上端部形成有与形成在大径螺旋弹簧端子的上端部的小径部接合的环状槽。 省略了将大直径螺旋弹簧端子固定到内部电路板，并且需要将两个螺旋弹簧端子分别焊接到内部电路板上作为传统技术，从而提高了端子座的安装可操作性。
-
公开(公告)号：US20080025532A1
公开(公告)日：2008-01-31
申请号：US11829444
申请日：2007-07-27
CPC分类号： H04R19/04 , H04R19/016
摘要： A microphone case includes: a plastic basic frame including a space for housing an electro-acoustic transducing unit; a plastic substrate for closing an opening of the space, the plastic substrate being bonded to the basic frame; conductive layers provided on the bonding surfaces of the basic frame and the substrate respectively, the conductive layers being electrically connected to each other; and exposed portions where the surfaces of the basic frame and the substrate are exposed, wherein the basic frame and the substrate are bonded to each other in the exposed portions.
摘要翻译： 麦克风壳体包括：塑料基本框架，其包括用于容纳电声换能单元的空间; 用于封闭所述空间的开口的塑料基板，所述塑料基板接合到所述基本框架; 导电层分别设置在基本框架和基板的接合表面上，导电层彼此电连接; 以及露出基部框架和基板的表面露出的部分，其中基体框架和基板在露出部分中彼此接合。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.011 秒)
