Abstract:
The present invention relates to a dielectric device that is suitable for miniaturization and height reduction and is surface-mountable. In a resonator unit Q1, a first hole 41 is provided to a dielectric substarate 1, extends from a surface 21 toward a surface 22 opposite thereto, opens in the surface 21, and has a first internal conductor 61 in the interior. A second hole 51 is provided to the dielectric substarate 1, opens in a surface 23 adjacent to the surface 21, extends from the surface 23 toward a surface 24 opposite thereto, and is connected with the first hole 41 in the interior of the dielectric substarate 1. The second hole 51 has a second internal conductor 81 in the interior, and the second internal conductor 81 is connected to the first internal conductor 61 in the interior of the dielectric substarate 1.
Abstract:
A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate.
Abstract:
A dielectric device includes a dielectric substrate, a plurality of resonator units, and first and second terminals. The dielectric substrate has an external conductor film thereon. Each of the resonator units has a hole and an internal conductor provided inside the hole and connecting with the external conductor film. The first terminal is provided on the dielectric substrate and electrically coupled with at least one of the resonator units. The second terminal is provided on the dielectric substrate and electrically coupled with at least another of the resonator units. An intermediate conductor film, which is a part of the external conductor film, is provided between the first and second terminals. The intermediate conductor film has an insulating film thereon.
Abstract:
A band pass filter is constituted of a dielectric block 2 having through holes 5 formed from one surface to the opposite surface and a single layered dielectric plate 3 joined to the dielectric block 2 such that the back surface thereof faces the one surface of the dielectric block 2.
Abstract:
A dielectric device includes a dielectric substrate, a plurality of resonator units, and first and second terminals. The dielectric substrate has an external conductor film thereon. Each of the resonator units has a hole and an internal conductor provided inside the hole and connecting with the external conductor film. The first terminal is provided on the dielectric substrate and electrically coupled with at least one of the resonator units. The second terminal is provided on the dielectric substrate and electrically coupled with at least another of the resonator units. An intermediate conductor film, which is a part of the external conductor film, is provided between the first and second terminals. The intermediate conductor film has an insulating film thereon.
Abstract:
A dielectric device includes a dielectric substrate that includes at least one resonator unit. An external conductor film covers most of the outer surface of the dielectric substrate, except one end surface. The at least one resonator unit includes a first hole and a second hole. The first hole is provided in the dielectric substrate, extending from the end surface to an opposite surface, being open at the end surface and the opposite surface, and having a first internal conductor inside thereof. The second hole is provided in the dielectric substrate at a predetermined distance from the first hole, extends from the end surface toward the opposite surface, being open at the end surface, closed at the opposite surface, and having a second internal conductor inside thereof. The second internal conductor is connected to the first internal conductor at the end surface.
Abstract:
A shield that can prevent the thickness of a dielectric filter from increasing without increasing the manufacturing cost of the dielectric filter is disclosed. The shield of the present invention is to be attached to a dielectric filter and has a first plate, a second plate elongated from the first end of the first plate in a predetermined direction, a third plate elongated from the second end of the first plate opposite to the first end in the predetermined direction, and a projecting part projecting from the first plate at a portion between the first and second ends of the first plate. Since the shield can be fixed to the dielectric filter by pinching the both side of the dielectric block and the projecting part can be in contact with the metallization of the dielectric filter, the total thickness of the dielectric filter does not increase even the shield is attached.
Abstract:
A dielectric device includes a dielectric substrate and a resonator unit. The resonator unit includes first and second holes. The first hole opens on a first surface of the dielectric substrate and extends toward a second surface opposite to the first surface. A first internal conductor is provided inside the first hole. The second hole opens on a third surface of the dielectric substrate, extends toward a fourth surface opposite to the third surface, and is connected to the first hole. A second internal conductor is provided inside the second hole with one end connected to an external conductor film on the third surface and the other end connected to the first internal conductor. The first hole has a recess opposed to a junction with the second hole. The first internal conductor in the recess is opposed to the external conductor film on the fourth surface across the dielectric substrate.