公开(公告)号：US06247986B1

公开(公告)日：2001-06-19

申请号：US09219803

申请日：1998-12-23

申请人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Parul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

发明人： Raymond C. Chiu ,  Timothy Lee Hoopman ,  Parul Edward Humpal ,  Vincent Wen-Shiuan King ,  Kenneth R. Dillon

IPC分类号： H01J924

CPC分类号： H01J9/242 ,  B29C33/303 ,  B29C33/40 ,  B29C33/424 ,  H01J9/241 ,  H01J2211/36 ,  H01J2217/49

摘要： A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.

摘要翻译： 使用微结构模具在图案化衬底上模制和对准微结构的方法。 将包含陶瓷粉末和可固化短效粘合剂的混合物的浆料放置在可拉伸模具的微结构和图案化基底之间。 可以拉伸模具以使模具的微结构与图案化基底的预定部分对准。 浆料在模具和基材之间硬化。 然后去除模具以留下粘附到基底上的微结构并与衬底的图案对准。 可以将微结构热加热以除去粘合剂并最佳地烧制以烧结陶瓷粉末。