公开(公告)号：US07858513B2

公开(公告)日：2010-12-28

申请号：US11764326

申请日：2007-06-18

申请人： Siddharth Mohapatra ,  Klaus Dimmler ,  Patrick H Jenkins

发明人： Siddharth Mohapatra ,  Klaus Dimmler ,  Patrick H Jenkins

IPC分类号： H01L21/4763

CPC分类号： H01L51/105 ,  H01L51/0005 ,  H01L51/0026 ,  H01L51/0541 ,  H01L51/0545

摘要： A low-cost and efficient process produces self-aligned vias in dielectric polymer films that provides electrical connection between a top conductor and a bottom conductor. The process is achieved by printing conductive posts on the first patterned conductive layer, followed by the deposition of an unpatterned layer dielectric, followed by the deposition of a second patterned conductive layer. The vias are formed during the flash annealing of the post after the dielectric is deposited, but before the second conductive layer is deposited. In this process, the post material is annealed with a flash of light, resulting in a release of energy which removes the dielectric on the top of the post.

摘要翻译： 低成本和高效的工艺在介电聚合物膜中产生自对准的通孔，其提供顶部导体和底部导体之间的电连接。 该过程通过在第一图案化导电层上印刷导电柱，然后沉积未图案化的电介质，随后沉积第二图案化导电层来实现。 在沉积电介质之后，但在沉积第二导电层之前，在柱的闪光退火期间形成通孔。 在该过程中，后材料用闪光退火，导致释放能量，其去除柱的顶部上的电介质。

公开(公告)号：US20080311698A1

公开(公告)日：2008-12-18

申请号：US11764326

申请日：2007-06-18

申请人： Siddharth Mohapatra ,  Klaus Dimmler ,  Patrick H. Jenkins

发明人： Siddharth Mohapatra ,  Klaus Dimmler ,  Patrick H. Jenkins

IPC分类号： H01L51/40

CPC分类号： H01L51/105 ,  H01L51/0005 ,  H01L51/0026 ,  H01L51/0541 ,  H01L51/0545

摘要： A low-cost and efficient process produces self-aligned vias in dielectric polymer films that provides electrical connection between a top conductor and a bottom conductor. The process is achieved by printing conductive posts on the first patterned conductive layer, followed by the deposition of an unpatterned layer dielectric, followed by the deposition of a second patterned conductive layer. The vias are formed during the flash annealing of the post after the dielectric is deposited, but before the second conductive layer is deposited. In this process, the post material is annealed with a flash of light, resulting in a release of energy which removes the dielectric on the top of the post.

摘要翻译： 低成本和高效的工艺在介电聚合物膜中产生自对准的通孔，其提供顶部导体和底部导体之间的电连接。 该过程通过在第一图案化导电层上印刷导电柱，然后沉积未图案化的电介质，随后沉积第二图案化导电层来实现。 在沉积电介质之后，但在沉积第二导电层之前，在柱的闪光退火期间形成通孔。 在该过程中，后材料用闪光退火，导致释放能量，其去除柱的顶部上的电介质。