Polymer Composition
    1.
    发明申请
    Polymer Composition 有权
    聚合物组成

    公开(公告)号:US20110253948A1

    公开(公告)日:2011-10-20

    申请号:US12598614

    申请日:2008-05-02

    IPC分类号: H01B1/22 H01B1/20 B82Y99/00

    摘要: A polymer composition comprises at least one substantially non-conductive polymer binder and at least first and second electrically conductive fillers. The first electrically conductive filler is comprised of particles having avoid-bearing structure; and the second electrically conductive filler is comprised of particles which are acicular in shape.

    摘要翻译: 聚合物组合物包含至少一种基本上不导电的聚合物粘合剂和至少第一和第二导电填料。 第一导电填料由具有避免结构的颗粒组成; 并且第二导电填料由针状的颗粒构成。