公开(公告)号：US20060054605A1

公开(公告)日：2006-03-16

申请号：US10976555

申请日：2004-10-29

申请人： Mark Huth ,  Philip Rourke ,  Craig Gates

发明人： Mark Huth ,  Philip Rourke ,  Craig Gates

IPC分类号： B23K26/38 ,  B23K26/14

CPC分类号： B23K26/146

摘要： A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.

摘要翻译： 提供了激光加工基板的方法。 该方法包括将激光能量定向在衬底的第一表面，同时至少在激光能量被引导的区域的近似地在衬底的第一表面处提供辅助介质。 在利用激光能量产生的基板中形成特征之前，不再提供辅助介质。