公开(公告)号：US08827553B2

公开(公告)日：2014-09-09

申请号：US12957736

申请日：2010-12-01

申请人： Holger Kaul ,  Manfred Wetzko ,  Marco Ulrich ,  Peter Krippner ,  Philipp Nenninger ,  Yannick Maret

发明人： Holger Kaul ,  Manfred Wetzko ,  Marco Ulrich ,  Peter Krippner ,  Philipp Nenninger ,  Yannick Maret

IPC分类号： G01K7/02 ,  G01K1/02 ,  G01K1/10

CPC分类号： G01K1/024 ,  G01K1/10 ,  G01K2215/00 ,  Y10T137/8158

摘要： The exemplary embodiments relate to an autonomous temperature transmitter for use in process installations. In order to feed an electronic component with energy, a thermoelectric transducer is arranged such that it is thermally operatively connected to at least one thermal conducting element between an internal thermal coupling element and an external thermal coupling element, the internal thermal coupling element being thermally coupled to the process medium and the ambient air flowing around the external thermal coupling element.

摘要翻译： 示例性实施例涉及用于过程安装的自主温度变送器。 为了以能量馈送电子部件，热电换能器被布置成使得其热操作地连接到内部热耦合元件和外部热耦合元件之间的至少一个导热元件，内部热耦合元件被热耦合 到处理介质和围绕外部热耦合元件流动的环境空气。

公开(公告)号：US20110162736A1

公开(公告)日：2011-07-07

申请号：US12957736

申请日：2010-12-01

申请人： Holger KAUL ,  Manfred Wetzko ,  Marco Ulrich ,  Peter Krippner ,  Philipp Nenninger ,  Yannick Maret

发明人： Holger KAUL ,  Manfred Wetzko ,  Marco Ulrich ,  Peter Krippner ,  Philipp Nenninger ,  Yannick Maret

IPC分类号： F17D3/00

CPC分类号： G01K1/024 ,  G01K1/10 ,  G01K2215/00 ,  Y10T137/8158

摘要： The exemplary embodiments relate to an autonomous temperature transmitter for use in process installations. In order to feed an electronic component with energy, a thermoelectric transducer is arranged such that it is thermally operatively connected to at least one thermal conducting element between an internal thermal coupling element and an external thermal coupling element, the internal thermal coupling element being thermally coupled to the process medium and the ambient air flowing around the external thermal coupling element.

摘要翻译： 示例性实施例涉及用于过程安装的自主温度变送器。 为了以能量馈送电子部件，热电换能器被布置成使得其热操作地连接到内部热耦合元件和外部热耦合元件之间的至少一个导热元件，内部热耦合元件被热耦合 到处理介质和围绕外部热耦合元件流动的环境空气。