公开(公告)号：US20100109673A1

公开(公告)日：2010-05-06

申请号：US12652325

申请日：2010-01-05

Applicant: PI-HUI TAI

Inventor： PI-HUI TAI

IPC: G01R31/00 ,  G02B9/04

CPC classification number: G01R31/2874

Abstract: A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole.

Abstract translation: 公开了一种配置在晶片测试器的波峰塔内的耐热透镜套件。 耐热透镜套件具有两个平行透镜和具有通孔的主体。 主体和两个平行透镜在通孔内包围一个真空室。

公开(公告)号：US20080211527A1

公开(公告)日：2008-09-04

申请号：US11819083

申请日：2007-06-25

Applicant: Pi-Hui Tai

Inventor： Pi-Hui Tai

IPC: G01R31/308

CPC classification number: G01R31/2874

Abstract: A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole.

Abstract translation: 公开了一种配置在晶片测试器的波峰塔内的耐热透镜套件。 耐热透镜套件具有两个平行透镜和具有通孔的主体。 主体和两个平行透镜在通孔内包围一个真空室。

公开(公告)号：US20120212250A1

公开(公告)日：2012-08-23

申请号：US13067977

申请日：2011-07-13

Applicant: Pi Hui Tai

Inventor： Pi Hui Tai

IPC: G01R31/26

CPC classification number: B01D46/0005 ,  B01D46/10 ,  B01D2279/45

Abstract: A semiconductor element testing system having an air filter includes a testing apparatus, a first hollow frame, a fan assembly, a second hollow frame, and an air filter. The testing apparatus includes a housing having an opening. The first hollow frame is arranged on the housing and includes a flange, a bottom surface, and a side portion, wherein a plurality of hooks are fixedly arranged on the side portion. The fan assembly is fixed on the first hollow frame such that a forced airflow can be supplied toward inside of the housing. The second hollow frame includes an outer side portion fixedly arranged with a plurality of loop fasteners corresponding to the plural hooks. The air filter covers on the opening of the housing. Thereby, floating particles of the testing system can be reduced so as to lower the possibility of contamination for chips.

Abstract translation: 具有空气过滤器的半导体元件测试系统包括测试设备，第一中空框架，风扇组件，第二中空框架和空气过滤器。 测试装置包括具有开口的壳体。 第一中空框架布置在壳体上并且包括凸缘，底表面和侧部，其中多个钩固定地布置在侧部上。 风扇组件固定在第一中空框架上，使得朝向壳体内部供应强制气流。 第二中空框架包括固定地布置有对应于多个钩的多个环紧固件的外侧部分。 空气过滤器覆盖在外壳的开口上。 因此，可以减少测试系统的漂浮颗粒，以降低芯片污染的可能性。