Oxyfluorination
    1.
    发明授权
    Oxyfluorination 有权
    氧氟化

    公开(公告)号:US07225561B2

    公开(公告)日:2007-06-05

    申请号:US10532461

    申请日:2003-10-23

    IPC分类号: F26B7/00

    摘要: The invention provides a process for the activation by oxyfluorination of at least part of a surface of a solid, which process includes exposing, under selected conditions of temperature and pressure and for a selected reaction time, at least part of the surface of the material of the solid to an oxfluorinating atmosphere. The oxyfluorinating atmosphere is a gas/vapor mixture which includes at least one fluorine-containing gas which reacts with the material of the exposed surface, at least one oxygen-containing gas which reacts with the material of the exposed surface, and water vapor. The gases in the oxyfluorinating atmosphere act to oxyfluorinate the exposed surface, thereby to activate it, and the water vapor acts to enhance the activation.

    摘要翻译: 本发明提供一种通过氟氧化活化固体表面的至少一部分的方法,该方法包括在选定的温度和压力条件下以及在选定的反应时间内暴露至少一部分材料的表面 固体成为氟化氟化气氛。 氟氧化气氛是气体/蒸汽混合物,其包括与暴露表面的材料反应的至少一种含氟气体,与暴露表面的材料反应的至少一种含氧气体和水蒸气。 氧氟化气氛中的气体用于使暴露的表面氟化氟化,从而使其活化,并且水蒸气起促进作用。

    Production of composites
    3.
    发明授权
    Production of composites 失效
    复合材料的生产

    公开(公告)号:US5744257A

    公开(公告)日:1998-04-28

    申请号:US398098

    申请日:1995-03-03

    摘要: A process for producing a composite material, structure or artifact comprising a cementitious substrate or matrix which is strengthened or reinforced by reinforcing material which adheres thereto, includes bringing a reinforcing component into contact with a cementitious substrate component which is in a settable state. The substrate component is allowed to set in contact with the reinforcing component, thereby to adhere thereto. Adhesion of the substrate component to the reinforcing component is enhanced by, prior to bringing the components into contact with each other, subjecting the reinforcing component to surface fluorination thereof.

    摘要翻译: 用于生产复合材料,结构或人造物的方法,其包括通过附着在其上的增强材料而被增强或增强的水泥基质或基质,包括使增强组分与处于可凝固状态的水泥基底组分接触。 允许基板部件与增强部件接触,从而粘附到基板部件上。 在使组分相互接触之前,通过使增强组分进行表面氟化,增强了基材组分对增强组分的粘合性。