公开(公告)号：US06766938B2

公开(公告)日：2004-07-27

申请号：US10042829

申请日：2002-01-08

申请人： Chi Wah Cheng ,  Ping Chun Chong ,  Chi Fung Chan ,  Chin Pang Chan

发明人： Chi Wah Cheng ,  Ping Chun Chong ,  Chi Fung Chan ,  Chin Pang Chan

IPC分类号： B23K3102

CPC分类号： B23K3/0623 ,  B23K35/0244 ,  B23K2101/42 ,  H01L21/4853 ,  H05K3/3478

摘要： The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.

摘要翻译： 本发明提供了一种用于将焊球定位在基板上的所需阵列的装置和方法。 提供了一种定位装置，用于将焊球定位在与焊球要吸附在衬底上的位置阵列相对应的位置。 一种用于接收多个焊球并且可以在远离定位装置的第一位置和直接在其之间的第二位置移动的容器将焊球提供给定位装置。 提供装置以使焊球从容器的第一位置移动到第二位置，从而减少或消除在这种运动期间对焊球的损坏。