公开(公告)号：US09038264B2

公开(公告)日：2015-05-26

申请号：US13265656

申请日：2011-02-28

Applicant: Pradeep Kumar Rai ,  Kim Lee Bock ,  Li Wang ,  JinXiang Huang ,  EnYong Tai ,  JianHua Wang ,  King Hoo Ong

Inventor： Pradeep Kumar Rai ,  Kim Lee Bock ,  Li Wang ,  JinXiang Huang ,  EnYong Tai ,  JianHua Wang ,  King Hoo Ong

IPC: B23P19/00 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L24/73 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T29/53191 ,  Y10T29/53283 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract translation: 公开了一种工具，用于在半导体晶片切割工艺期间将半导体管芯与其上固定有裸片的带分离。 该工具包括用于将真空尖端定位在要移除的半导体管芯上的拾取臂。 真空尖端包括用于夹持半导体晶片的非均匀阵列的真空孔。

公开(公告)号：US20120216396A1

公开(公告)日：2012-08-30

申请号：US13265656

申请日：2011-02-28

Applicant: Pradeep Kumar Rai ,  KL Bock ,  Li Wang ,  JinXiang Huang ,  EnYong Tai ,  JianHua Wang ,  KH Ong

Inventor： Pradeep Kumar Rai ,  KL Bock ,  Li Wang ,  JinXiang Huang ,  EnYong Tai ,  JianHua Wang ,  KH Ong

IPC: B23P19/00

CPC classification number: H01L21/6836 ,  H01L24/73 ,  H01L24/75 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T29/53191 ,  Y10T29/53283 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A system is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The system includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Abstract translation: 公开了一种用于在半导体晶片切割工艺期间将半导体管芯与其上固定有裸片的带分离的系统。 该系统包括用于将真空尖端定位在要移除的半导体管芯上的拾取臂。 真空尖端包括用于夹持半导体晶片的非均匀阵列的真空孔。