COMPONENT MOUNTER
    6.
    发明申请
    COMPONENT MOUNTER 审中-公开

    公开(公告)号:US20170280598A1

    公开(公告)日:2017-09-28

    申请号:US15508521

    申请日:2014-09-04

    发明人: Kenji HARA

    IPC分类号: H05K13/04 H05K13/08 H05K13/00

    摘要: Control device 80 of component mounter 11 performs control such that after a component supplied by reel unit 56 is picked up by nozzle 40 of mounting head 24 and before the component is mounted on board 12, the component is temporarily placed at a specified position of temporary placement surface 71. Also, control device 80, after performing control such that the component is temporarily placed at the specified position, determines whether the component has actually been temporarily placed at the specified position based on the pressure state at a hole provided at the specified position of temporary placement surface 71 to which negative pressure is being supplied, and performs processing according to the determination result. Because the determination of whether the component has actually been temporarily placed is based on the pressure state of the hole provided in temporary placement surface 71, the determination is performed rapidly compared to a case in which the presence of the component is checked by analyzing an image of temporary placement surface 71 captured from above.

    Conductive ball mounting method
    9.
    发明授权
    Conductive ball mounting method 有权
    导电球安装方法

    公开(公告)号:US09516763B2

    公开(公告)日:2016-12-06

    申请号:US13709354

    申请日:2012-12-10

    发明人: Kazunari Ikeda

    IPC分类号: H05K3/34 B23K1/20 H01L21/48

    摘要: A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting portions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in portions corresponding to the mounting portions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount.

    摘要翻译: 一种导电球安装方法,其使用阵列掩模将导电球安装在安装座上,其中所述安装件包括以预定图案形成的安装部分,并且所述阵列掩模设置在所述安装件的上方,并且包括设置在与所述安装件对应的部分中的通孔 部分。 该方法包括提供用于吸取焊球的球吸引单元,该球吸引单元包括能够保持导电球的球保持构件,将导电球吸附在球吸引单元下方,将导电球保持在下游表面上 在保持导电球的同时吸引导电球的球保持构件,使由球保持构件保持的导电球落到基座上。